Electronic Components Challenges in AI Power Management
Tomáš Zedníček Ph.D. (EPCI)
COTS and AI Transforming Space Operations
Ralph Grundler (Aitech)
AI-Driven Secure Electronics Manufacturing: Detecting Counterfeit and Hardware Tampering
Alexa Falconer (Cybord)
Braided Solder Columns for Next Generation Large Heterogeneous 2.5D Packages
Marty Hart (TopLine)
GaN and InP Chiplet Integration in CMOS Wafers for Millimeter- Wave Front-Ends
Florian Herrault (PseudolithIC)
IBM Research - Recent Developments in Advanced Components
Julian Warchall, Ph.D. (IBM)
KEYNOTE: Northrop Grumman Microelectronics Center (NGMC) Supports Next Generation Packaging Technologies
Louise Sengupta, Ph.D. (Northrop Grumman)
New MIL PRF Metal Strip Current Sense
Brian Yarborough (Vishay Dale)
Advanced Technology Microcircuit (ATM) QML Development
Sultan Lilani (Integra Technologies)
Overview of Non-Hermetic Advanced Packaging
Jeff Gotro, Ph.D. (InnoCentrix)
Integrated Thin Film Passive Components: A New Option for Miniature Flight Electronics
Ron Demcko (Kyocera/AVX)
Miniaturization and Performance Improvement of Electronic Systems by Utilizing Embedded Thin-film Resistors and Gap Capacitors
John Andresakis (Quantic Electronics)
Advanced Reflowable Chip Capacitor for Military and Space Electronics and Embedded Solutions
Christopher Deane (Fastcap)
A Common Approach to Characterizing Electronic Components for Demanding Applications
Brian Ward (Vishay Vitramon)
KEYNOTE: Evolution of EEE Parts for Space Missions
Larry Harzstark (The Aerospace Corporation)
Benefits of a Hybrid Planar Transformer Package and an Overview of Product Screening Levels
Jackson Sonterre (Vishay Inductors)
Advancements of Stacked Capacitors for Military and Flight Applications
Tyler Lagnese (Kyocera/AVX)
The First 3-terminal Ceramic Gap Capacitor
Alex Moalemi (Quantic Eulex)
Commercialization of GN3 Graphene Material as the Active Electrode for High Energy
Tomas Zednicek (EPCI)
Lessons Learned from Buying Commercial Wafers for MIL Project
Ben Mendoza (Golden Altos)
Destructive Physical Analysis (DPA) of Electronic Components – A Primer On MIL-STD-1580 “DPA for EEE Parts”
Sultan Lilani/Trevor Devaney (Integra/Hi-Rel Labs)
Addressing the Growing Challenges of Electronic Component Unavailability and Industry Knowledge Loss
Rob Picken (Sourceability)
Scaling National Security: The SCALE Program’s Role in Growing the Nation’s Skilled Microelectronics Workforce
Peggy E. Williams, Ph.D. (NSWC Crane)
Improved Impedance Measurement Precision Utilizing Innovative Test Fixture Design
J. Gaylord Gasque, William R. Harrell, Kyle Jenko (SKG Automation LLC, Clemson, Universal Avionics)
Why Planar Magnetics are ideal for Harsh Environments
Jim Marinos (Payton America)
Tin Whiskers
Jeff Montgomery (AEM)
Cu Direct Plating Technology on Quartz Glass for RF Application
Tetsuya Onishi (Koto Electric Co.)
NASA extreme cold summary
Ron Demcko (Kyocera/AVX)
