A veteran-owned small business, TJ Green Associates, LLC is a leader in teaching and consulting services for the assembly and packaging of microelectronic components used in high-reliability military, space and medical device applications.
Expertise in materials and processes used to assemble:
- Hybrids and Multichip Modules
- Class III Medical Implants
- Microwave Hybrids RF/MMIC Modules
- IMAs Integrated Microwave Assemblies
- MEMS and Sensors
- Optoelectronics for Telecommunications Industry
- Semiconductors and Diodes
- Packaged ICs and Microcircuits
Areas of packaging expertise include:
- Hermetic and “Near Hermetic” Packaging
- Hermeticity Testing TM 1014
- Die Attach Eutectic and Epoxy
- Wirebond Ribbon Bond Deep Access Bonding
- Materials and Process Development
- Process Validation via SPC DOE Analytical Methods
- Failure Analysis and Root Cause Identification
- Visual Inspection MIL-STD-883
Thomas J. Green
Thomas J. Green has more than 40 years combined experience in industry/academia and the Department of Defense, including years developing curriculum and teaching industry professionals about microelectronics assembly-related materials and processes.
Serving as a Research Scientist at the U.S. Air Force Rome Air Development Center, Tom worked as a reliability engineer analyzing component failures from fielded avionic equipment.
As a Senior Process Engineer with Lockheed Martin Astronautics in Denver, Tom was responsible for materials and processes used to assemble hybrid microelectronic components for military and aerospace applications. While with Lockheed, he gained invaluable experience in wirebond, die attach, thick- and thin-film substrate fabrication, hermetic sealing, and hermeticity testing.
For the last 20 years, Tom’s expertise has helped position his company as a recognized industry leader in teaching and consulting services for high-reliability military, space, and medical device applications.
Tom serves as an expert witness, consultant, and trainer in hermeticity and the materials and processes used to assemble Hybrids, MCMs (Multichip Modules), RF (Radio Frequency) and microwave modules, MEMS (Micro-Electro- Mechanical–Systems), Class III medical implants, optoelectronics, and other types of packaged microcircuits and sensors.
A Fellow of IMAPS (International Microelectronics and Packaging Society) with extensive leadership duties, he served more than 20 years as Chair of the IMAPS National Professional Development Courses and was a National Technical Committee member.
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To download Tom's Curriculum Vitae click here.