25th Annual Components for Military & Space Electronics Conference
April 25-29, 2022
VIRTUAL CONFERENCE
(After careful review by the CMSE organizing committee we decided to go all virtual this year. Pricing and registration for the conference can be found below.)
The premier event focused on the design, reliability, and application of electronic components for use in both terrestrial applications for avionics, aerospace, and military, as well as commercial, civilian, and military space systems.
The Mission:
Deliver a conference experience focused on high quality technical talks, keynotes and panel discussions that foster maximum attendee participation/interaction and furthers our collective understanding of the technical challenges faced in our industry. Showcase the supplier base to the greatest extent possible. Educate the industry, especially young component engineers, in order to secure the future defense of our country.
The Program:
- Keynote talks by industry leaders and invited speakers
- Technical presentations by industry experts with Q&A
- Numerous suppliers from the active and passive device community interacting with attendees
- Cutting edge technical tutorials taught by industry experts
- Opportunities for students and young professionals planning a career in the military and aerospace industry
Click the “+” symbol to review registration details.
General Registration
Included in your registration:
- 3 days of technical presentations with interactive Q&A
- Live Keynote presentations each day from industry leaders
- Access to a FREE 3-hour Tutorial on Monday afternoon on component specs, Overview of Microelectronic Component Specs for Military and Space Electronics (more tutorials available on Monday and Friday for an additional fee)
- All presentations available for review online for up to 30 days
- PDF copy of slides for each presentation available for download to each attendee
- Full registration details for all exhibitors and attendee
Cost: $395
Included in your registration:
- 3 days of technical presentations with interactive Q&A
- Access to all paid tutorials on Monday and Friday
- Live Keynote presentations each day from industry leaders
- Access to a FREE 3-hour Tutorial on Monday afternoon on component specs, Overview of Microelectronic Component Specs for Military and Space Electronics (more tutorials available on Monday and Friday for an additional fee)
- All presentations available for review online for up to 30 days
- PDF copy of slides for each presentation available for download to each attendee
- Full registration details for all exhibitors and attendee
Cost: $995
Tutorial Registration Options
Instructors: Dr. Yuri Freeman, KEMET
Ron Demcko, AVX
Description:
The Passive Component Reliability Workshop course will be presented in three sessions covering capacitors, inductors and resistors.
This tutorial will be presented in two sections. The first 90 minutes covers tantalum & electrolytic capacitors presented by Dr. Yuri Freeman. The second half of the session covers a wide range of technologies ranging from ceramic to film, stacked modules and SuperCaps presented by Ron Demcko…read more
REGISTER NOW! This is in addition to the free tutorial #2 scheduled for Monday afternoon.
Cost: $395.00
Instructors: Mark D. Poliks & Benson Chan, Center for Advanced Microelectronics Manufacturing (CAMM), Integrated Electronics and Engineering Center (IEEC), State University of New York at Binghamton
Description:
This course is intended to provide an overview to many disciplines within electronics packaging. It will describe all aspects of interconnects starting with the silicon device down to the final product and will address the needs for environmental testing to reliability assessments. We will also include an overview on the current state of the industry.…read more
REGISTER NOW! This is in addition to the free tutorial #2 scheduled for Monday afternoon.
Cost: $395.00
Instructors: Trevor Devaney, Hi-Rel Laboratories, Inc.
Robert Lowry, Electronics Materials Consultant
Description:
The design and packaging of microelectronic devices such as hybrids, RF microwave modules, Class III medical implants and other types of packaged microcircuits intended for high reliability systems is a critical aspect of reliability engineering. This course is intended to review and highlight the typical kinds of microelectronic packaging related failures that occur during manufacturing, qualification and the unfortunate field failures. FA (failure analysis) tools and techniques that are utilized to understand root cause of failure and guide corrective actions will also be addressed by experts with years of experience working in FA labs…read more
REGISTER NOW! This is in addition to the free tutorial #2 scheduled for Monday afternoon.
Cost: $395.00
Exhibitor Registration Options
Included in your registration:
- One attendee pass
- Includes prime time vendor presentation (15 mins with Q&A) during the Application Notes Session
- Included in special promotional emailers and advertisement as a sponsor
- Listed in final program book as sponsor
- Company listing and exposure for 30 days on CMSE
- Attendee list with full contact details
- Additional advertising opportunities available
Cost: $995
Included in your registration:
- One attendee pass
- Includes prerecorded 10-15 min vendor presentation or PDF presentation available for review anytime by attendee
- Posted link to company home page and exposure during the conference
- Company listing and exposure for 30 days on CMSE website
- Attendee list with full contact details
- Additional advertising opportunities available
Cost: $695