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CMSE 2023 Technical Talks
DERATING & TECHNOLOGY IN POLYMER TANTALUM CAPACITORS
Y. Freeman and P. Lessner (Yageo)
DERATING TANTALUM CAPACITORS DEPENDS ON THE CATHODE SYSTEM
Jon Rhan & Jerard Jose (Vishay)
THE NEXT DECADE CAPACITOR REQUIREMENTS FROM AUTOMOTIVE TO SPACE ENVIRONMENTS
Tomas Zednicek Ph.D. (EPCI)
ESA RECENT CHALLENGES IN SPACE MISSIONS: CRACKED CAPACITORS’ TIME BOMB AND FORBIDDEN SOLDERLESS CONNECTORS
Léo Farhat (ESA)
A Simplified Approach to Choosing a DC Blocking Capacitor
Brian Ward (Vishay)
EFFECT OF DEFECT DYNAMICS ON RELIABILITY OF X7R MULTILAYER CERAMIC CAPACITORS
Pedram Yousefian (Penn State)
KEYNOTE: DOD AND THE CHIPS ACT – ENSURING NATIONAL SECURITY REQUIREMENTS ARE PART OF THE IMPLEMENTATION
Christine Michienzi, Ph.D.
BUILDING RESILIENCE INTO YOUR SUPPLY CHAIN
Peter Guinto (Resilinc)
CHALLENGES WITH THE CHIPS ACT
Sultan Lilani (Integra)
DESIGNING AND APPLICATION CONSIDERATIONS FOR SPACE GRADE FERRITE BEADS
Scott Harris (Vanguard)
ULTRACAPACITORS - OPERATE IN ENVIRONMENTS BEYOND BATTERY CAPABILITIES
Mitch Koffel (Nanoramic)
New Products Offerings for Military and Spacecraft Electronics with various screening and QCI options
Richard Duong (Q-Tech)
Compact and Reliable Transformer with Integrated Inductor
Victor W. Quinn (Exxelia)
Copper Braided Solder Columns – Extending Life in Space Applications
Martin Hart (Topline)
Legacy Program Engineering Stock Validation and Counterfeit Inspection
Aaron Dermarderosian (Raytheon)
KEYNOTE - Striking a Balance Between Compliance and Risk
James W. Wade, Ph.D.
ADVANCED PACKAGING: CRITICAL ECOSYSTEM AND RELIABILITY CONSIDERATIONS
Kaysar Rahim (Northrop Grumman)
THERMAL ANALYSIS OF DIE ATTACH MATERIALS FOR A HIGH POWER GAN DEVICE
Casey Krawiec (Stratedge)
THE EVOLUTION OF MOORE’S LAW THROUGH CHIPLETIZED ARCHITECTURES
Tony Trinh, Thomas Smelker, Trevor Ashby, Jennifer Keenan (Mercury)
Effective Advanced Heat Spreading Thermal Solutions For GaN Devices
Bill Ishii (Sumitomo)
AN INTEGRATED WORKFLOW FOR SEMICONDUCTOR PACKAGE DESIGN
Andras Vass-Varnai, Albert Prosuk, Jimmy He (Siemens)
New GaN Power Products for Avionics, Defense & Space
Roger Roisen (Teledyne)
TGV CU METALLISATION ON GLASS TECHNOLOGY FOR AVIONICS APPLICATION
Onishi Tetsuya, Masatoshi Takayama (Koto)
Advanced Packaging for Government Needs
Julian Warchall, Ph.D., Saverio Fazzari (Booz Allen Hamilton)
PWB DELAMINATION DEFECTS ON OVERHAUL & REPAIR (O/R) ASSEMBLIES. ANALYSIS AND VARIANCES TO J-STD-001H & IPC-A-610
Aaron Dermarderosian (Raytheon)
SUPPLY CHAIN QUALITY CHALLENGES
Zac Elliott, Asaf Jivilik (Siemens)
NON-HERMETIC INHERENTLY ROBUST FILM CAPACITOR DESIGNS FOR EMBEDDED POWER APPLICATIONS IN MILITARY AND SPACE ELECTRONICS
Zach Kilsmith (Quantic Paktron)
CERAMIC AND METAL REPACKAGING OF PLASTIC ENCAPSULATED MICROCIRCUITS FOR HERMETIC SOLUTIONS
Erick M. Spory, Ph.D. (Global Circuit)
Recent Advances in Microcircuit Standards
Shri Agarwal (NASA JPL)
CONNECTOR UPSCREENING FOR SPACE APPLICATIONS
Ted Bartlett (Integra)
Efficient DC Voltage Conversion Without Switching – A Path to Extremely Compact and Low-Noise DC Voltage Regulators
Matthew Lumb (Polaris Semiconductor LLC)
ENHANCING MICROELECTRONIC PACKAGE RELIABILITY THROUGH GETTER MATERIAL INTEGRATION AND INNER GAS ATMOSPHERE CHARACTERIZATION
Luca Mauri, Giovanni Zafarana, Enea Rizzi, Alessio Corazza (SAES)
Novel Waffle Pack Lid Clip System Shows Promise in Mitigating Costly Thin Die Migration
Darby Davis (Gel-Pak), Craig Blanchette (BAE Systems)
