2023 Technical Talks | Wednesday 4/26

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DERATING & TECHNOLOGY IN POLYMER TANTALUM CAPACITORS

Y. Freeman and P. Lessner (Yageo)
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DERATING TANTALUM CAPACITORS DEPENDS ON THE CATHODE SYSTEM

Jon Rhan & Jerard Jose (Vishay)
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DERATING & TECHNOLOGY IN POLYMER TANTALUM CAPACITORS

Tomas Zednicek Ph.D. (EPCI)
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ESA RECENT CHALLENGES IN SPACE MISSIONS: CRACKED CAPACITORS’ TIME BOMB AND FORBIDDEN SOLDERLESS CONNECTORS

Léo Farhat (ESA)
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A Simplified Approach to Choosing a DC Blocking Capacitor

Brian Ward (Vishay)
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EFFECT OF DEFECT DYNAMICS ON RELIABILITY OF X7R MULTILAYER CERAMIC CAPACITORS

Pedram Yousefian (Penn State)
Christine Michienzi CHIPS Act

KEYNOTE:

DOD AND THE CHIPS ACT – ENSURING NATIONAL SECURITY REQUIREMENTS ARE PART OF THE IMPLEMENTATION

Christine Michienzi, Ph.D.

Senior Technology Advisor to the Undersecretary of Defense for Acquisition & Sustainment

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BUILDING RESILIENCE INTO YOUR SUPPLY CHAIN

Peter Guinto (Resilinc)
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CHALLENGES WITH THE CHIPS ACT

Sultan Lilani (Integra)
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DESIGNING AND APPLICATION CONSIDERATIONS FOR SPACE GRADE FERRITE BEADS

Scott Harris (Vanguard)
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ULTRACAPACITORS - OPERATE IN ENVIRONMENTS BEYOND BATTERY CAPABILITIES

Mitch Koffel (Nanoramic)
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New Products Offerings for Military and Spacecraft Electronics with various screening and QCI options

Richard Duong (Q-Tech)
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Compact and Reliable Transformer with Integrated Inductor

Victor W. Quinn (Exxelia)
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Copper Braided Solder Columns – Extending Life in Space Applications

Martin Hart (Topline)
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Legacy Program Engineering Stock Validation and Counterfeit Inspection

Aaron Dermarderosian (Raytheon)
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Gas Analysis Capabilities

Jayeshkumar Das, Ph.D. (EAG Labs)

2023 Technical Talks | Thursday 4/27

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KEYNOTE - STRIKING A BALANCE BETWEEN COMPLIANCE AND RISK

James W. Wade, Ph.D.

Engineering and Mission Assurance Executive

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THERMAL ANALYSIS OF DIE ATTACH MATERIALS FOR A HIGH POWER GAN DEVICE

Kaysar Rahim (Northrop Grumman)
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THERMAL ANALYSIS OF DIE ATTACH MATERIALS FOR A HIGH POWER GAN DEVICE

Casey Krawiec (Stratedge)
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THE EVOLUTION OF MOORE’S LAW THROUGH CHIPLETIZED ARCHITECTURES

Tony Trinh, Thomas Smelker, Trevor Ashby, Jennifer Keenan (Mercury)
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Effective Advanced Heat Spreading Thermal Solutions For GaN Devices

Bill Ishii (Sumitomo)
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AN INTEGRATED WORKFLOW FOR SEMICONDUCTOR PACKAGE DESIGN

Andras Vass-Varnai, Albert Prosuk, Jimmy He (Siemens)
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New GaN Power Products for Avionics, Defense & Space

Roger Roisen (Teledyne)
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Advanced Packaging for Government Needs

Julian Warchall, Ph.D., Saverio Fazzari (Booz Allen Hamilton)
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PWB DELAMINATION DEFECTS ON OVERHAUL & REPAIR (O/R) ASSEMBLIES. ANALYSIS AND VARIANCES TO J-STD-001H & IPC-A-610

Aaron Dermarderosian (Raytheon)
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Supply Chain Quality Challenges

Zac Elliott, Asaf Jivilik (Siemens)
CMSE 2023 Presentations

NON-HERMETIC INHERENTLY ROBUST FILM CAPACITOR DESIGNS FOR EMBEDDED POWER APPLICATIONS IN MILITARY AND SPACE ELECTRONICS

Zach Kilsmith (Quantic Paktron)
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CERAMIC AND METAL REPACKAGING OF PLASTIC ENCAPSULATED MICROCIRCUITS FOR HERMETIC SOLUTIONS

Erick M. Spory, Ph.D. (Global Circuit)
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Recent Advances in Microcircuit Standards

Shri Agarwal (NASA JPL)
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CONNECTOR UPSCREENING FOR SPACE APPLICATIONS

Ted Bartlett (Integra)
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Efficient DC Voltage Conversion Without Switching – A Path to Extremely Compact and Low-Noise DC Voltage Regulators

Matthew Lumb (Polaris Semiconductor LLC)
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ENHANCING MICROELECTRONIC PACKAGE RELIABILITY THROUGH GETTER MATERIAL INTEGRATION AND INNER GAS ATMOSPHERE CHARACTERIZATION

Luca Mauri, Giovanni Zafarana, Enea Rizzi, Alessio Corazza (SAES)
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Novel Waffle Pack Lid Clip System Shows Promise in Mitigating Costly Thin Die Migration

Darby Davis (Gel-Pak), Craig Blanchette (BAE Systems)