CMSE 2017 Presentations
Keynote - Michael J. Sampson
Keynote - Dave Davis
Session 1 - Hermetic Vs Non-Hermetic Packaging…..Is Our Fate Sealed?
1.1 Hermetic and Non-Hermetic QML ICs – Current Status and Challenges
1.2 COTS & COTS + Tantalum Capacitor Failures Confirm Systemic Moisture Sensitivity Issues
1.3 The New Tighter Hermeticity Test Leak Requirements – European Overview
1.4 Hermetic Weld Schedule Optimization Based Tighter TM 1014 Leak Rate Specifications
1.5 Meeting the New Tighter Hermeticity Requirements with Optical Leak Testing (OLT)
Session 2 - Passive Components and Packaging Methods for Hi Rel/Space Applications
2.1 Degradation and ESR Failures in MnO2 Chip Tantalum Capacitors
2.2 Tantalum Polymer Capacitors: COTS plus Solutions for Space Applications
2.3 Polymer Tantalum Capacitors Under Vacuum
2.4 Advanced Polymer Capacitors
2.5 Hermetic Tantalum Caps for High Power Pulse Applications
2.6 Base Metal Ceramic Capacitors for High Reliability Applications
2.7 A Low Profile High Power Inductor for High Reliability Applications
Session 3 - Copper Wire Bonding for High Reliability Applications
3.2 A Review on Copper Wirebond Technology in PEMs
3.3 Assessment of Copper Bond Wire for Use in Long Term Military Applications
3.4 Decapsulation of Copper Wire Bonded Devices
3.5 CU Bond Wire Reliability & Decapsulation Process
3.6 Flexible Copper Welded Interconnects for Crosstalk Reduction in WBG Power Modules
Session 5 - Obsolete Components and Counterfeit Parts
5.1 A Counterfeit Component Case History
5.2 Integrated Circuit Redesign Obsolescence: Assembly Options and Solutions
5.3 Implications of COTS Packaging Modifications in Legacy Systems
5.4 Risks with Obsolete Military Marked Components from the Open Market