CMSE 2025 - TUTORIALS
Microelectronic Component Engineering Principles and Practices
Component Engineering & Its Changing Role
Ron Demcko (Kyocera/AVX)
DPA 2025
Trevor Devaney (Hi-Rel Labs)
Overview of the Failure Analysis Process and Common Failure Mechanisms in Various Electronic Components
Trevor Devaney (Hi-Rel Labs)
Tantalum Capacitors
Brian Ward (Vishay)
Capacitor Technology
Ron Demcko (Kyocera/AVX)
Microelectronic Component Engineering Principles and Practices
Thomas J. Green (TJ Green Associates)
PEM DPA Example
Trevor Devaney (Hi-Rel Labs)
Design and Test of Non-Hermetic Microelectronics for Military and Space
Materials and Processes for Non- Hermetic Packaging
Jeff Gotro, Ph.D. (InnoCentrix)
Design and Test of Non-Hermetic Microelectronics for Military and Space
Thomas J. Green (TJ Green Associates)
Reference Documents Download
CMSE 2025 - Tutorial #2
Understanding the Military Standards and Update on JEDEC and New Spec Initiatives
Understanding the Military Standards and Update on JEDEC / SAE CE-12 and Initiatives
Shri Agarwal (NASA Jet Propulsion Laboratory), Sultan Lilani (Integra Technologies), Lawrence Harzstark (Aerospace Corp.)
JEDEC JC13 Overview
Shri Agarwal (NASA Jet Propulsion Laboratory)
Active Parts
Lawrence Harzstark (Aerospace Corp.)