July 28, 2020
Silver Epoxy Turns Black After an Oxygen Plasma Clean Prior to Wire Bonding…But So What? Thomas GreenTJ Green Associates, LLC739 Redfern Lane,Bethlehem, PA 18017email: tgreen@tjgreenllc.com Philipp […]
October 3, 2017
22nd Annual Components for Military & Space Electronics Conference & Exhibition May 7-10th, 2018 Four Points by Sheraton (LAX) Los Angeles, California Organized by engineers for engineers, […]
September 29, 2017
A Critical Review of MIL-STD-883 Wirebond Visual Inspection Criteria An important consideration in wirebonding is visual inspection of the deformed wire after wirebond formation. The amount […]
June 6, 2017
Minnowbrook 2017 “Moisture In Microelectronics” Minnowbrook, A forested retreat at the University of Syracuse Conference Center in the Adirondack Mountains of New York where engineers, scientists […]
October 2, 2016
Hermeticity Evaluation Testing Problem Statement: Leak testing per Mil-Std-883 only provides a single, one-time room ambient check of the integrity of the hermetic seal. The reality […]