Silver Epoxy Turns Black After an Oxygen Plasma Clean Prior to Wire Bonding…But So What?
July 28, 2020
Silver Epoxy Turns Black After an Oxygen Plasma Clean Prior to Wire Bonding…But So What?
July 28, 2020

Wirebond Challenges in Microwave RF MMIC Modules for Military and Space

Wirebonding complex hybrids and large RF MMIC Microwave Modules present a unique set of challenges for wirebond engineers. There are a myriad of bond pad metallurgies, very small bond pad sizes, differing heights within the package and a variety of loop shape profiles needed in order to assemble the device. Looping is a particular problem because the loop shape can affect RF performance. Gate pads on RF devices are often less than 2 X 2 mils, tail lengths must be tightly controlled in order to avoid damage to nearby air bridges.

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