CMSE Conference 2026 | Components for Military & Space Electronics Conference

SPONSOR OPPORTUNITIES

TECHNICAL PROGRAM

CMSE 2026 TUTORIALS

APRIL 28

Tuesday

0700

Student Registration / Breakfast

0800-1600

Advanced Microelectronic Component Engineering Principles and Practices (Full Day)

Preview Presentation Notes

Instructors: Thomas J Green (TJ Green Associates), Ron Demcko (Kyocera/AVX), Trevor Devaney (Hi-Rel Labs), Jerad Jose (Vishay)

0800-1200

Introduction to Electronics Failure Analysis (Half Day AM SESSION)

Preview Presentation Notes

Instructor: Ken Turner (Hi-Rel Laboratories)

1300-1700

Introduction to and Advances in 2.3D Fan-Out Wafer Level Packaging (FO-WLP) (Half Day PM Session)

Preview Presentation Notes

Instructor: Beth Keser (Volantis Semiconductor)

1615-1745

Understanding the Military Standards and Update on JEDEC and New Spec Initiatives (1.5 HouRs)

Preview Presentation Notes

Instructors: Shri Agarwal (NASA JPL), Ben Mendoza (Promex Industries), Adam Johnson (Integra Technologies)

Free to anyone attending the conference with prior registration

1800-1900 Student/Professional Networking Reception

This is an opportunity for students and young professionals to interact with industry professionals actively working in the field of microelectronics. Come out and enjoy some drinks and hors d'oeuvres and learn about component engineering and exciting career opportunities in the aerospace industry.
Must register below to attend.

COST: FREE

Sponsored By:

CMSE 2026 TECHNICAL TALKS

final program lineup subject to change

Click Talk Title To View Abstract

0700 (Registration)

Coffee Available in Exhibits Area (Sponsored by Kyocera/AVX)

0800

Opening remarks - cmse chair

Thomas J Green (TJ Green Associates)

KEYNOTE

Microelectronics: Critical Enabler for Innovation in Commercial and Military Systems

Devanand K. Shenoy, Ph.D. (IBM Research)

DLA Standards and Specifications Benefit the Military and Space Users’ Community

Muhammad Akbar (Defense Logistics Agency - DLA)

ESCC evolution: Enhanced Grade Component for improving the availability of strategic EEE component in Europe

Denis Lacombe (ESA - European Space Agency)

0950-1020 (Coffee Break Sponsor Kyocera/AVX)

Using AEC-Q Semiconductors in Military and Aerospace Applications

Kevin Parmenter (Taiwan Semiconductor)

MLCC Product Grades Explained: From Commercial to Space Applications

Tyler Lagnese (Kyocera/AVX)

1115-1200 (Lunch & Learn)

High-throughput Additive Manufacturing of Microelectronics including Passive and Active Components for 3D HI, Legacy Electronics and Advanced Packaging

Ahmed Busnaina, Ph.D. (Nano OPS)

1200-1350 (Lunch Sponsor Kyocera/AVX)

COTS Integration: Success & Challenges in Mission Critical Systems

Aaron C. Dermarderosian (Collins Aerospace)

Sn/Pb Conversion and Up Screening of Surface Mount COTS Components and AEM, Inc. Lessons Learned

Jeff Montgomery (AEM)

Solder Column Reliability in Extreme Cold

Marty Hart (TopLine)

BGA Reballing for Mission-Critical Applications

Minerva Cruz (Six Sigma Microelectronics)

1530-1600 (Coffee Break Sponsor Kyocera/AVX)

Innovative Ceramic Sub-Mounts and Heat Spreaders

Chandra Gupta, PhD (Remtec)

Critical Improvements in Thermal Materials and Characterization Tools for TIMs

Dave Saums (DS&A LLC)

Thermal Management at the Component and Board Level

Bruce Guldin (Vishay)

Selection, Metrology Controls and Reliability Performance of Thermal Interface Materials (TIM) in Advanced 3D Package Designs

Dr. Christo Bojkov (Danche)

1745-2000 Welcome Reception In Exhibits Area

final program lineup subject to change

Click Talk Title To View Abstract

0700

Coffee Available in Exhibits Area Sponsored by Presidio

0800 KEYNOTE

Ultra-Low Loss & Precision Passive Components for Quantum Computing: Market Opportunities & Technology

Dennis M. Zogbi (Paumanok)

Limitations in Today’s Passive Electrical Components

Dr. Eric Langlois (BAE Systems)

Low Inductance Bulk Capacitors

Ron Demcko, Allen Maya, Daniel West, Joe Hock (Kyocera/AVX)

New High Voltage Reconstituted Mica Capacitors to Pulse or Filter in One Small SMD Package

Jimmy Duwattez & Hector Nieves (Exxelia)

1000-1030 (Coffee Break Sponsor Presidio)

Eliminating Wirebonds in RF Modules: A New Class of Low-ESL Capacitors

Mark Simpson (UTC & Eulex - Evans Group)

Why Capacitors Do What They Do

David Zawacki (CalRamic Technologies)

Predicting TVA Attenuation Across Temperature Using Measurement-Based Mathematical Models

Wes Laquerre (IMS)

Wire Bonding and Ultrasonic Smart Welding for Space Applications

Mike McKeown, Ph.D. (Hesse Mechatronics)

From Spaceflight to EUV Lithography: High Reliability Outgassing and RGA Testing

Jayeshkumar Das (Oneida Research Services)

1210-1330 (Lunch Sponsor Presidio)

IBM: Pioneering Emerging Compute

Julian Warchall, Ph.D. (IBM)

Bridging the Reliability Chasm: Applying AI-Driven Predictive Forensics to Qualify Electronics for Military & Space Environments

Eisuke Tsuyuzaki (Bayflex Solutions)

Achieving High‑Reliability Semiconductor Components Production in a Fully Outsourced Manufacturing Mode

Don Larson (Eastern States Components)

Laser Trimming for High-Precision Sensors

Bill Solari (Photonics Systems USA)

Scaling National Security: The SCALE Program’s Role in Growing the Nation’s Skilled Microelectronics Workforce

Peggy E. Williams, Ph.D. (NSWC Crane)

Die Solutions for Space Constrained Hybrid Applications

Joe Beck (Central Semiconductor)

A RadHard Logic Level MOSFET for Military and Space Applications

Joe Benedetto, Mark McNulla and Mehrdad Namin (VPT Components)

John R. Devaney Award for best presentation

The CMSE program committee will award a $1,500 cash prize in honor of John R. Devaney for best presentation at the conference

S P O N S O R E D B Y: H I - R E L L A B S