CMSE 2026 - TUTORIALS
TUTORIAL #1
Advanced Microelectronic Component Engineering Principles and Practices
Component Engineering Principles & Practices
Ron Demcko (Kyocera/AVX)
Capacitor Technology
Ron Demcko (Kyocera/AVX)
DPA 2026
Trevor Devaney (Hi-Rel Labs)
DPA Examples
Trevor Devaney (Hi-Rel Labs)
Destructive Physical Analysis (DPA) of Electronic Components: A Primer On MIL-STD-1580 “DPA for EEE Parts”
Trevor Devaney (Hi-Rel Labs)
Aluminum & Tantalum Capacitors
Jose Jerard (Vishay)
Introduction and Overview of “Non-Hermetics” for Mil and Space
Thomas J. Green (TJ Green Associates)
Microelectronic Component Engineering Principles and Practices
Thomas J. Green (TJ Green Associates)
TUTORIAL #2
Introduction to Electronics Failure Analysis
Introduction to Electronics Failure Analysis
Ken Turner (Hi-Rel Labs)
TUTORIAL #4
Understanding the Military Standards and Update on JEDEC and New Spec Initiatives
JEDEC & CE-12 Overview
Ben Mendoza (Promex)