CMSE 2024 - TUTORIALS
Microelectronic Component Engineering For The 2020s
Microelectronic Component Engineering for the 2020’s
Ron Demcko (Kyocera/AVX)
Tantalum Capacitors
Jon Rhan (Vishay)
Capacitor Technology
Ron Demcko (Kyocera/AVX)
Microelectronics Materials and Processes
Thomas J. Green (TJ Green Associates)
DPA 2024
Trevor Devaney (Hi-Rel Labs)
Overview of the Failure Analysis Process and Common Failure Mechanisms in Various Electronic Components
Trevor Devaney (Hi-Rel Labs)
Heterogeneous Integration Packaging Reliability Challenges and Roadmap
Heterogeneous Integration Packaging Reliability Challenges and Roadmap (Part 1)
Richard Rao (Marvell)
Heterogeneous Integration Packaging Reliability Challenges and Roadmap (Part 2)
Richard Rao (Marvell)
Heterogeneous Integration Packaging Reliability Challenges and Roadmap (Part 3)
Richard Rao (Marvell)
Understanding the Military Standards and Update on JEDEC and New Spec Initiatives
Understanding the Military Standards and Update on JEDEC / SAE CE-12 and Initiatives
Lawrence Harzstark (Aerospace Corp.), Sultan Lilani (Integra Technologies), Shri Agarwal (NASA Jet Propulsion Laboratory), Rod De Leon (Boeing Corporation)