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25th Annual Components for Military & Space Electronics Virtual Conference

April 25-29, 2022


CMSE Conference Agenda and Program Information

Click daily tabs at top to review program, then click presentation titles on each page to review abstracts. REGISTER HERE!

(All times shown are Eastern Daylight Time)

Monday

  • Tutorial 1

    -

    Capacitor Reliability Seminar

  • Tutorial 2

    -

    Overview of Microelectronic Component Specs for Military and Space Electronics

Tuesday

  • Keynote #1

    -

    Ms. Robin Brown, OSD DMSMS

  • Tech Session 1A

    -

  • Application Notes

    -

  • Student Session

    -

  • Application Notes

    -

  • Tech Session 1B

    -

Wednesday

  • Keynote #2

    -

    Dr. Darren J. Crum, NSWC Crane Division

  • Tech Session 2A

    -

  • Application Notes

    -

  • Student Session

    -

  • Application Notes

    -

  • Tech Session 2B

    -

Thursday

  • Keynote #3

    -

    Jay Santee, The Aerospace Corporation

  • Tech Session 3A

    -

  • Application Notes

    -

  • Tech Session 3B

    -

  • Student Session 3 - Awards Ceremony & Speed Networking

    -

Friday

  • Tutorial 3

    -

    Electronics Packaging: Fundamentals and Opportunities

  • Tutorial 4

    -

    Microelectronic Packaging Failure Modes and Analysis

Click presentation title to review abstract. Final program subject to change.

Tutorial #1 (1030-1400)

Capacitor Reliability Seminar
Dr. Yuri Freeman, KEMET
Ron Demcko, KYOCERA AVX Components Corporation

A major failure mechanism for electronic systems is inadequate heat dissipation, both from individual components and at the system level. Heat is the single largest cause of failure, with vibration and dust and other environmental factors as examples of other factors. Understand the issues and learn how to mitigate…read more

Tutorial #2 (1400-1800)

Overview of Microelectronic Component Specs for Military and Space Electronics
Lawrence Harzstark, The Aerospace Corporation
Peter Majewicz, NASA Goddard
Ron Demcko, Kyocera AVX Components Corporation

This three-hour overview class is intended to focus on the myriad of specs available to component engineers working the field of microelectronics. There are many legacy and emerging mil and commercial specifications to select form and they can be very confusing and overwhelming to the inexperienced user…read more

Click presentation title to review abstract. Final program subject to change.

Introduction and Conference Kickoff (1030) - Tom Green CMSE Chair

Keynote #1 (1040-1130)

DoD Microelectronics Access—Taking Holistic Action Before it’s too Late
Ms. Robin Brown, OSD DMSMS and Parts Management Program Manager

Session #1A (1130-1400) Session Chair: Daniel West, KYOCERA AVX Components Corporation

Novel Graphene Material for High Energy Storage Supercapacitors
Tomas Zednicek, Ph.D., EPCI European Passive Components Institute

Useful Life of Tantalum Capacitors
Alexander Teverovsky, Jacobs Technology Inc.

A Brief History of Volumetric Efficiency
James Turner, Ph.D. & Ed Jones, KEMET

Vendor Application Notes (1400-1500)

(15 min presentations designed to give suppliers a chance to talk about how their products or services fulfill a need in the community)

KEMET Corporation (1400-1415)
KYOCERA AVX Components Corporation (1415-1430)
Presidio Components, Inc. (1430-1445) CANCELLED
ES Components (1445-1500) (Microchip talks about their SiC products)

Student Session 1 (1500-1600)

$3,000 in prize money up for grabs thanks to our sponsors, Hi-Rel Laboratories and AVX!

The intent of the CMSE student program is to allow Students, PhD Candidates and Young Professionals (3 years since graduation) an opportunity to participate in CMSE at no charge and learn more about a career in the military and aerospace industry.

Just email amber@tjgreenllc.com from your school email address or company email address to receive a coupon code for free registration.

  • Dazzle us with your knowledge of an array of obvious, fascinating or little-known facts about space and electronics! Trivia Contest Rules
  • The registration cutoff date for the Student Trivia contest is Thurs, April 21.
  • Student/Professional Networking: Talk to us about a career in the military/aerospace industry on the last day (4/28). Ask questions regarding career paths and job opportunities. Includes a 45-minute Speed Networking session where you and your peers can interact with seasoned industry professionals.

Vendor Application Notes (1600-1630)

Session #1B (1630-1750) Session Chair: Daniel West, KYOCERA AVX Components Corporation

New Stacked MLCCs to Extend Performance Capability
John Bultitude, Ph.D. & Wilson Hayworth, KEMET

Click presentation title to review abstract. Final program subject to change.

Keynote #2 (1030-1120)

Heterogeneous Integration As An Enabler To System Modernization
Darren J. Crum, Ph.D., NSWC Crane Division

Session #2A (1120-1400) Advanced Packaging/ Heterogeneous Integration - Session Chair: Sultan Lilani, Integra Technologies

State of the Art (SOTA) Heterogeneous Integrated Packaging (SHIP) Digital
John Sotir, Intel Corp. Programmable Solutions Group

Engineering and Production Considerations for SIPs
Matt Bergeron, Integra Technologies

SupIR-SMD™: Advanced Rad Hard MOSFET Packaging Designed for Direct-to-PCB Mounting
Oscar Mansilla & Shunhe Xiong, IR HiRel, an Infineon Technologies Company

Paper-thin Electronics
James J. Wang, Power Gold

Vendor Application Notes (1400-1500)

Epirus Inc. (1400-1415)

Student Session 2 (1500-1600)

Dazzle us with your knowledge of an array of obvious, fascinating or little-known facts about space and electronics (see Student Session 1 on Tuesday)! Trivia Contest Rules

Vendor Application Notes (1600-1630)

Cybord LTD (1600-1630) A visual verification solution for counterfeit parts detection.

Session #2B (1630-1750) Session Chair: Fred Schipp, NSWC Crane

Click presentation title to review abstract. Final program subject to change.

Keynote #3 (1100-1140)

Session #3A (1140-1300) Digital Engineering: What It Means to Military and Space Electronics - Session Chair: Allyson Yarbrough Ph.D., Aerospace Corporation

Spatial Grasp As A Model for Space-based Control and Management Systems
Peter Simon Sapaty, Institute of Mathematical Machines and Systems National Academy of Sciences

Digital Engineering and Digital Twin in the Space Domain
Dr. Bob Minnichelli, Aerospace Corporation

R&M Physics of Failure Handbook and Digital Evolution Plan
Anthony J. DiVenti & Nancy Lindsey, NASA

Vendor Application Notes (1300-1400)

MicroCircuit Laboratories LLC (1300-1315)
SMART Microsystems Ltd. (1315-1330)
Delphon/Gel-Pak (1330-1345)
ES Components (1345-1400) (Joe Benedetto from VPT Components discuss their Linear Bipolar IC’s)

Session #3B (1400-1600) - Session Chair: Larry Harzstark, Aerospace Corporation

Long Term Dormant Storage And Hermetic Package Leak Dynamics
Bob Lowry, Tom Green, TJ Green Associates, LLC

Getter Technologies for Improving Microelectronic Package Reliability
H. Xia, R. Rockley, J. Vriens, S. Norris, & D. DeWire, Hermetic Solutions Group, LLC

Student Session 3 (1600-1745)

Creating a Skilled Worker Pipeline for Microelectronics
Kara Perry, Ph.D., Naval Surface Warfare Center, Crane Division

  • Student Trivia contest awards ceremony
  • John Devaney award for best technical presentation at CMSE
  • Closing remarks by Tom Green
  • Student/professional Speed Networking session

Click presentation title to review abstract. Final program subject to change.

Tutorial #3 (1030-1400)

Electronics Packaging: Fundamentals and Opportunities
Mark D. Poliks & Benson Chan, Center for Advanced Microelectronics Manufacturing (CAMM), Integrated Electronics and Engineering Center (IEEC), State University of New York at Binghamton

Tutorial #4 (1400-1800)

Microelectronic Packaging Failure Modes and Analysis
Trevor Devaney, Hi-Rel Laboratories, Inc.
Robert Lowry, Electronics Materials Consultant