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Agenda + Advance Program

Monday

  • Tutorial 1

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  • Tutorial 2

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Tuesday

  • Keynote

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  • Tech Session

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  • Application Notes

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  • Alternate Grade Parts Panel

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  • Student Session

    -

  • Application Notes

    -

  • Tech Session

    -

Wednesday

  • Keynote

    -

  • Tech Session

    -

  • Luncheon Speaker

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  • GaN Panel

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  • Student Session

    -

  • Application Notes

    -

  • Tech Session

    -

Thursday

  • European Session

    -

  • Keynote

    -

  • Tech Session

    -

  • Application Notes

    -

  • Tech Session

    -

  • Student Session/Interactive Panel

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Friday

  • Tutorial 3

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  • Tutorial 4

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click presentation titles to review abstract, final program subject to change

Tutorial #1 (1030-1400)

Thermal Materials and Testing: Key Solutions for Mil/Aerospace Electronics Systems
Dave Saums, DS&A LLC

A major failure mechanism for electronic systems is inadequate heat dissipation, both from individual components and at the system level. Heat is the single largest cause of failure, with vibration and dust and other environmental factors as examples of other factors. Understand the issues and learn how to mitigate…read more

Tutorial #2 (1400-1730)

Overview of Microelectronic Component Specs for Military and Space Electronics
Lawrence Harzstark, Aerospace
Peter Majewicz, NASA Goddard
Ron Demcko, AVX

This three-hour overview class is intended to focus on the myriad of specs available to component engineers working the field of microelectronics. There are many legacy and emerging mil and commercial specifications to select form and they can be very confusing and overwhelming to the inexperienced user…read more

click presentation titles to review abstract, final program subject to change

Keynote #1 (1030-1120)

Session #1A (1120-1300)
Passive Components for Military and Hi Rel Space Systems

Surface Mount Wet Tantalum Capacitor Technology
Jon Rhan & Mike Mosier, Vishay

Hybrid Capacitor Technology for Hi-Rel Applications
Misha Pierre-Mike, Evans Capacitor Company

Vendor Application Notes (1300-1330)

presentations from the supplier base 15 min each

Panel Discussion (1330-1500)

Status, Risks and How to Use Alternate Grade Products for Military and Space Application
Panelists:
Rod de Leon, The Boeing Company
Allyson Yarbrough, Aerospace Corp
Gary Reichmuth, Texas Instruments
Yuri Freeman, KEMET INC

Moderator:
Sultan Lilani, Integra Technologies

Format will be a 5 to 10-minute presentation by each panelist and 45 minutes of Q&A.

Student Session 1 (1500-1600)

NEW for CMSE in 2021! Competitions and Valuable Prizes!

This year at CMSE 2021 we plan to focus some time on students and young professionals planning a career in the military and aerospace industry as component engineers, process engineers, QEs, designers etc.

Special Events for Students and Young Professionals:

  • Undergraduates and graduate students: Inform and impress us by presenting your research to a panel of friendly judges!
  • Young professionals (3 years since graduation): Dazzle us with your knowledge of an array of obvious, fascinating or little-known facts about space and electronics!
  • Ask questions regarding career paths and job opportunities of seasoned professionals currently working in our industry.

Vendor Application Notes (1600-1630)

presentations from the supplier base 15 min each

Session #1B (1630-1750)
Passive Components for Military and Hi Rel Space Systems

click presentation titles to review abstract, final program subject to change

Keynote #2 (1030-1120)

Technology Assurance for Space Systems in an Age of Rapid Diversification
Dr. Jonathan “Jonny” Pellish, NASA’s Electrical, Electronic, Electromechanical, and Electro-Optical (EEEE) Parts Manager

Session #2A (1120-1300)
GaN for RF and Power Focused Session

GaN and SiC for RF and Power Management
Scott Harris, Vanguard Electronics Company

Why GaN in Space?
Shengke Zhang, Ph.D

Organic Packaging for 5G and 40Ghz Applications
Jay Chudasama, Agile Microwave Technology

Presentation #5
TBD

CMSE Invited Luncheon Speaker (1300-1400) - TBD

Panel Discussion (1400-1500)

Gallium Nitride (GaN) technology for power and high frequency devices is an  emerging technology for military and space applications. This technology is used in power semiconductor devices as well as RF and high frequency microwave components.  This interactive panel discussion with industry experts will explore how military and space applications can take the advantages GaN technologies to develop more efficient and higher performance electronic systems.

Moderator:
John Scarpulla, Aerospace Corp

Format will be a 5 minute presentation from each panelist to state what they see as the technology issues followed by 45 minutes of interactive Q&A with conference attendees.

Student Focused Session (1500-1600)

Vendor Application Notes (1600-1630)

2 presentations from the supplier base 15 min each

Session #2B (1630-1750)
Reliability Session

DoD / Aerospace perspectives on the transition to Lead free solder technologies!
Anthony J. Rafanelli, Ph. D., P.E., Fellow ASME, Raytheon Technologies

Presentation  #3
TBD

Presentation  #4
TBD

click presentation titles to review abstract, final program subject to change

Session #3A (1000-1120)
European Union Session COTS Focus

Session Chair: Tomas Zednicek, Ph.D., EPCI European Passive Components Institute

Title TBD
Manuel Morales, Alter Technology TÜV NORD S.A.U.

Automotive Capacitors Procurement for SME Space Hardware Manufacturer Case Study
Tomas Zednicek, Ph.D., EPCI European Passive Components Institute

Keynote #3 (1120-1200)

Physical Assurance and Inspection of Electronics
Dr. Navid Asadi, University of Florida

Globalization has made the semiconductor industry more susceptible to trust and security issues. Hardware Trojans, i.e., malicious modification to electronic systems, can violate the root of trust when the device or systems are fabricated/assembled in untrusted facilities. As the imaging and failure analysis tools excel in the resolution and capability, physical inspection-based methods become more attractive in verifying such trust issues. On the contrary…read more

Session #3B (1200-1300)
Supply Chain and Security

Supply Chain Research and Analysis: Illuminating Risks in Complex Systems
Jonathan Root, NASA Goddard Space Flight Center

Presentation #3
TBD

Vendor Application Notes (1300-1400)

presentations from the supplier base 15 min each

Session #3C (1400-1600) - Title TBD

Characteristics of Practical CTE-Matched Composites for Electronics Thermal Management: Newest Materials and Comparative Analysis
Dave Saums, Principal, DS&A LLC

Presentation #5
TBD

Presentation #6
TBD

Student Focused Session 3 (1600-1800)

click presentation titles to review abstract, final program subject to change

Tutorial #3 (1030-1400)

Volatiles Control in Hermetic Electronic Components
Thomas Green, TJ Green Associates, LLC
Robert Lowry, Electronics Materials Consultant

This tutorial includes a basic review of the Mil Spec test methods in place to prevent moisture related failures in military and Hi Rel systems where functional component reliability is of utmost importance (e.g. IC’s, Hybrids, MEMS and sensors, Class III Medical, Optoelectronics, etc). The focus is on hermeticity testing per MIL-STD-883 TM 1014 and the latest developments and understanding of RGA (Residual Gas Analysis) per TM 1018. Hydrogen mitigation strategies and methods will also be reviewed…read more

Tutorial #4 (1400-1730)

Capacitor Reliability Seminar
Dr. Yuri Freeman, KEMET
Ron Demcko, AVX

The Passive Component Reliability Workshop course will be presented in three sessions covering capacitors, inductors and resistors.

This tutorial will be presented in two sections. The first 90 minutes covers tantalum & electrolytic capacitors presented by Dr. Yuri Freeman. The second half of the session covers a wide range of technologies ranging from ceramic to film, stacked modules and SuperCaps presented by Ron Demcko…read more

Evolution of EEE standard with regards to COTS and New Space
Dr Lacombe Denis,  ESA/ESTEC

The Supplier-Customer Interface
Bob Lowry, Electronics Materials Consultant

Wire Bonding to Niobium for Quantum Computing Applications
Michael McKeown, Hesse Mechatronics, Inc.

SMD Characterization Using Progressive De-embedding Methods with a VNA
Rebecca Wilson, Copper Mountain Technologies

Copper Ball Bonding Reliability
Lee Levine, Process Solutions Consulting, Inc.

Glass solutions for mmWave applications
Aric Shorey, Mosaic Microsystems

Multi-Project Wafer Sort and Inspection Applications
Sarah Parrish, Royce Instruments