Click presentation title to review abstract. Final program subject to change.

Capacitor Reliability Seminar
Dr. Yuri Freeman, KEMET
Ron Demcko, KYOCERA AVX Components Corporation

A major failure mechanism for electronic systems is inadequate heat dissipation, both from individual components and at the system level. Heat is the single largest cause of failure, with vibration and dust and other environmental factors as examples of other factors. Understand the issues and learn how to mitigate…read more

Overview of Microelectronic Component Specs for Military and Space Electronics
Lawrence Harzstark, The Aerospace Corporation
Peter Majewicz, NASA Goddard
Ron Demcko, Kyocera AVX Components Corporation

This three-hour overview class is intended to focus on the myriad of specs available to component engineers working the field of microelectronics. There are many legacy and emerging mil and commercial specifications to select form and they can be very confusing and overwhelming to the inexperienced user…read more

Click presentation title to review abstract. Final program subject to change.

DoD Microelectronics Access—Taking Holistic Action Before it’s too Late
Ms. Robin Brown, OSD DMSMS and Parts Management Program Manager

Novel Graphene Material for High Energy Storage Supercapacitors
Tomas Zednicek, Ph.D., EPCI European Passive Components Institute

Useful Life of Tantalum Capacitors
Alexander Teverovsky, Jacobs Technology Inc.

Exploration of ACC Phenomena in Polymer Tantalum Capacitors
Jonathan Voelm, Ball Aerospace

A Brief History of Volumetric Efficiency
James Turner, Ph.D. & Ed Jones, KEMET

Lessons Learned About Using Commercial Solid Tantalum Capacitors in Military Electronics
Rick Rodriguez, Raytheon Technologies

The Use of Advanced Tantalum Commercial Products in High Reliability Applications
Jon Rhan, Vishay

Supply Chain Technology for Better Visibility, Innovation, and Supplier Relationship Management
Sumit Vakil, Resilinc

(15 min presentations designed to give suppliers a chance to talk about how their products or services fulfill a need in the community)

KEMET Corporation (1400-1415)
KYOCERA AVX Components Corporation (1415-1430)
Presidio Components, Inc. (1430-1445) CANCELLED
ES Components (1445-1500) (Microchip talks about their SiC products)

$3,000 in prize money up for grabs thanks to our sponsors, Hi-Rel Laboratories and AVX!

The intent of the CMSE student program is to allow Students, PhD Candidates and Young Professionals (3 years since graduation) an opportunity to participate in CMSE at no charge and learn more about a career in the military and aerospace industry.

Just email amber@tjgreenllc.com from your school email address or company email address to receive a coupon code for free registration.

• Dazzle us with your knowledge of an array of obvious, fascinating or little-known facts about space and electronics! Trivia Contest Rules
• The registration cutoff date for the Student Trivia contest is Thurs, April 21.
• Student/Professional Networking: Talk to us about a career in the military/aerospace industry on the last day (4/28). Ask questions regarding career paths and job opportunities. Includes a 45-minute Speed Networking session where you and your peers can interact with seasoned industry professionals.

Vanguard Electronics Company (1600-1615)

Space Grade Product Extension for X7R Capacitors, Low Inductance IDC X7R / X7S Components and NPO Discrete Devices
John Marshall, KYOCERA AVX Components Corporation

New Considerations for Multi Layer Ceramic Capacitors in Military and Space Applications
Brian Ward, Vishay

New Stacked MLCCs to Extend Performance Capability
John Bultitude, Ph.D. & Wilson Hayworth, KEMET

Click presentation title to review abstract. Final program subject to change.

Heterogeneous Integration As An Enabler To System Modernization
Darren J. Crum, Ph.D., NSWC Crane Division

State of the Art (SOTA) Heterogeneous Integrated Packaging (SHIP) Digital
John Sotir, Intel Corp. Programmable Solutions Group

Department of Defense (DoD) State of the Art (SOTA) Heterogeneous Integrated Packaging (SHIP) RF Program
Ted Jones, Qorvo Inc.

State of the Art Hetergeneous Integrated Computing Enabling Warfare Modernization Capabilities
Tom Smelker, Mercury Systems

Engineering and Production Considerations for SIPs
Matt Bergeron, Integra Technologies

Advanced Technology Microcircuit (ATM) QML Development
Eli Minson, Maxar

SupIR-SMD™: Advanced Rad Hard MOSFET Packaging Designed for Direct-to-PCB Mounting
Oscar Mansilla & Shunhe Xiong, IR HiRel, an Infineon Technologies Company

Paper-thin Electronics
James J. Wang, Power Gold

Epirus Inc. (1400-1415)

Dazzle us with your knowledge of an array of obvious, fascinating or little-known facts about space and electronics (see Student Session 1 on Tuesday)! Trivia Contest Rules

Cybord LTD (1600-1630) A visual verification solution for counterfeit parts detection.

NESC Assessment – Recommendations on Use of Commercial-Off-The-Shelf (COTS) Electrical, Electronic, and Electromechanical (EEE) Parts for NASA Missions
Yuan Chen & Dr. Robert F. Hodson, NASA

Counterfeit Electronic Part Trends in the Pandemic
Fred Schipp, NSWC Crane

Solving for Diminishing Manufacturing Sources and Material Shortages (DMSMS) Using Data-Driven Solutions
Frank Cavallaro, A2 Global

Click presentation title to review abstract. Final program subject to change.

The Unfolding Digital Transformation Sweeping the Space Enterprise
Jay Santee, Aerospace Corporation

Spatial Grasp As A Model for Space-based Control and Management Systems
Peter Simon Sapaty, Institute of Mathematical Machines and Systems National Academy of Sciences

Avoiding Aerospace Electronics Failures, Thermal Testing and Simulation of High-Power Semiconductor Components
Albert Prosuk and Andras Vass-Varnai, Siemens

Digital Engineering and Digital Twin in the Space Domain
Dr. Bob Minnichelli, Aerospace Corporation

R&M Physics of Failure Handbook and Digital Evolution Plan
Anthony J. DiVenti & Nancy Lindsey, NASA

MicroCircuit Laboratories LLC (1300-1315)
SMART Microsystems Ltd. (1315-1330)
Delphon/Gel-Pak (1330-1345)
ES Components (1345-1400) (Joe Benedetto from VPT Components discuss their Linear Bipolar IC’s)

Bandpass filter Failure Analysis- Supplier, Production & Rework Challenges
Aaron Dermarderosian, Raytheon Technologies

Failure Modes (and Avoidance) of Space Grade Magnetics
Scott Harris, Vanguard

Failure Analysis and Resolution of an Electrochemical Corrosion Degradation Process Caused By Pop-corning/Flux Ingress on a GaAs pHEMT — Arrested Through Moisture Starvation
Randall Lewis, Steven Buchoff, Michael Langlois, Northrop Grumman

Long Term Dormant Storage And Hermetic Package Leak Dynamics
Bob Lowry, Tom Green, TJ Green Associates, LLC

Getter Technologies for Improving Microelectronic Package Reliability
H. Xia, R. Rockley, J. Vriens, S. Norris, & D. DeWire, Hermetic Solutions Group, LLC

Challenges & Opportunities in Teaching Component Engineering Skills to Students & Young Engineers
Professor Bobby Compton, Duke University

Creating a Skilled Worker Pipeline for Microelectronics
Kara Perry, Ph.D., Naval Surface Warfare Center, Crane Division

• Student Trivia contest awards ceremony
• John Devaney award for best technical presentation at CMSE
• Closing remarks by Tom Green
• Student/professional Speed Networking session

Click presentation title to review abstract. Final program subject to change.

Electronics Packaging: Fundamentals and Opportunities
Mark D. Poliks & Benson Chan, Center for Advanced Microelectronics Manufacturing (CAMM), Integrated Electronics and Engineering Center (IEEC), State University of New York at Binghamton

Microelectronic Packaging Failure Modes and Analysis
Trevor Devaney, Hi-Rel Laboratories, Inc.
Robert Lowry, Electronics Materials Consultant