Click presentation title to review abstract. Final program subject to change.

Thermal Materials and Testing: Key Solutions for Mil/Aerospace Electronics Systems
Dave Saums, DS&A LLC

A major failure mechanism for electronic systems is inadequate heat dissipation, both from individual components and at the system level. Heat is the single largest cause of failure, with vibration and dust and other environmental factors as examples of other factors. Understand the issues and learn how to mitigate…read more

Overview of Microelectronic Component Specs for Military and Space Electronics
Lawrence Harzstark, Aerospace
Peter Majewicz, NASA Goddard
Ron Demcko, AVX

This three-hour overview class is intended to focus on the myriad of specs available to component engineers working the field of microelectronics. There are many legacy and emerging mil and commercial specifications to select form and they can be very confusing and overwhelming to the inexperienced user…read more

Click presentation title to review abstract. Final program subject to change.

Capitalizing on the Benefits of Alternate Grade Electronics with Informed Risk
Brian Hardt, Aerospace Corp

Selection of Polymer Tantalum Capacitors for Class A Space Missions
Michael Cozzolino, Aerospace Corporation

Surface Mount Wet Tantalum Capacitor Technology
Jon Rhan & Mike Mosier, Vishay

Hybrid Capacitor Technology for Hi-Rel Applications
Misha Pierre-Mike, Evans Capacitor Company

Effect of Preconditioning on Post-soldering Failures In Tantalum Capacitors
Alexander Teverovsky, Jacobs Engineering Group

A Comparison of Commercial, Automotive and Aerospace Capacitors
Daniel West, AVX Corporation

Vishay Intertechnology, Inc. (1300-1315)
Palomar Technologies (1315-1330)

EEE parts suppliers are struggling with supply chain, cost and obsolescence issues. This directly impacts Military/Space OEMs ability to get timely, cost effective, reliable components for their projects. The panel for “Alternate Grade Parts” will discuss the various alternate grade parts that are potentially available (i.e. Automotive grade, COTS, and PEMS) and the risks/rewards associated with them vs established Military and Space grade parts such as, Class S microcircuits or Mil-Prf-55365 capacitors.

Points of Discussion:

• Various flavors of alternate grade parts
• Strategies for use of automotive grade and PEMs for Mil/Space
• Pros and Cons of alternate grade parts

Panelists:
Allyson Yarbrough, Aerospace Corp
Yuri Freeman, KEMET
Mark Porter, NASA JPL
David Locker, US Army

Moderator:
Sultan Lilani, Integra Technologies

Format will be a 5 to 10-minute presentation by each panelist and 45 minutes of Q&A.

NEW for CMSE in 2021! Competitions and Valuable Prizes!

This year at CMSE 2021 we plan to focus time on students and young professionals planning a career in the military and aerospace industry as component process or quality engineers, designers or researchers.

• $4,000 in student prize money is up for grabs thanks to our sponsors, Hi-Rel Laboratories and AVX!

Conference is FREE for grad students, undergrads and young professionals (3 years since graduation) already working in the field. Email amber@tjgreenllc.com from your school email address or company email address to receive a coupon code for free registration.

Special Events for Students, PhD Candidates and Young Professionals (3 years since graduation):

• Dazzle us with your knowledge of an array of obvious, fascinating or little-known facts about space and electronics! Trivia Contest Rules
• The cutoff date for the Student Trivia contest is Mon, April 19, 11:59pm Pacific. In order to participate in the contest you must first email amber@tjgreenllc.com and register for the CMSE event as an attendee at no charge using the coupon code provided.
• Talk to us about a career in the military/aerospace industry during a special interactive panel on the last day. Ask questions regarding career paths and job opportunities of seasoned professionals currently working in our industry. Start to network and build relationships with others.

TopLine Corporation (1600-1630)

Inter-Digitated Capacitors (IDC) for Space and Military Applications
John Marshall, AVX Corporation

Stacked Polymer Tantalum Capacitors – Advanced Packaging Technology
Joe Vattimo, Vishay Tantalum Division

Tantalum Capacitors: High Reliability Product Hierarchy and New Advance Products
Ed Jones, KEMET

Commercialization of Space: Industry Trends, Component Selection
Wilson Hayworth, KEMET

Click presentation title to review abstract. Final program subject to change.

Technology Assurance for Space Systems in an Age of Rapid Diversification
Dr. Jonathan “Jonny” Pellish, NASA’s Electrical, Electronic, Electromechanical, and Electro-Optical (EEEE) Parts Manager

GaN and SiC for RF and Power Management
Scott Harris, Vanguard Electronics Company

Why GaN in Space?
Shengke Zhang, Ph.D

Thermal Considerations for High Power GaN RF Amplifiers
Manuel Romero, Cree/Wolfspeed

Qualification Activities at Qorvo for GaN Space Applications
Gergana Drandova, Ph.D., Qorvo

Status of “Guidelines for Space Qualification of GaN HEMT Technologies”
John Scarpulla, The Aerospace Corporation

Strategic Parts and Material Management – a Proactive Lifecycle Approach to Handle Obsolescence
Ms. Robin Brown, OUSD (R&E) DMSMS and Parts Program Manager

Gallium Nitride (GaN) technology for power and high frequency devices is an  emerging technology for military and space applications. This technology is used in power semiconductor devices as well as RF and high frequency microwave components.  This interactive panel discussion with industry experts will explore how military and space applications can take the advantages GaN technologies to develop more efficient and higher performance electronic systems.

Panelists:
Paul Hebert, International Rectifier HiRel Products, Inc.
John Scarpulla, The Aerospace Corporation
Keith Benson, Analog Devices, Inc.

Moderator:
Gary Lerude, Microwave Journal

Format will be a 5 minute presentation from each panelist to state what they see as the technology issues followed by 45 minutes of interactive Q&A with conference attendees.

Dazzle us with your knowledge of an array of obvious, fascinating or little-known facts about space and electronics (see Student Session 1 on Tuesday)! Trivia Contest Rules

Gel-Pak (1600-1615)
Hesse Michatronics (1615-1630)

DoD / Aerospace perspectives on the transition to Lead free solder technologies!
Anthony J. Rafanelli, Ph. D., P.E., Fellow ASME, Raytheon Technologies

Electrical Overstress Failure Analysis- Mission critical transient voltage suppressor power applications
Aaron Dermarderosian, Raytheon Technologies

Proactive Concepts for Selecting and Applying Parts/Components, Materials, and Processes (PMPs) for High Reliability Applications
Jeff Jarvis, US ARMYDEVCOM AVMC

Click presentation title to review abstract. Final program subject to change.

Evolution of EEE standard with regards to COTS and New Space
Dr. Denis Lacombe, ESA/ESTEC

Updated approach for passive-COTS (ECSS-Q-ST-60-13). Practical case.
Manuel Morales, Alter Technology TÜV NORD S.A.U.

Automotive Capacitors Procurement for SME Space Hardware Manufacturer Case Study
Tomas Zednicek, Ph.D., EPCI European Passive Components Institute

Method for Qualitative Evaluation of COTS Board Reliability
Vincent Martinez, Serma Technologies

Physical Assurance and Inspection of Electronics
Dr. Navid Asadi, University of Florida

Globalization has made the semiconductor industry more susceptible to trust and security issues. Hardware Trojans, i.e., malicious modification to electronic systems, can violate the root of trust when the device or systems are fabricated/assembled in untrusted facilities. As the imaging and failure analysis tools excel in the resolution and capability, physical inspection-based methods become more attractive in verifying such trust issues. On the contrary…read more

Microelectronic Authenticity and Security, Evaluation, and Research
Diganta Das, University of Maryland

Methods for Evaluating the Effectiveness of 2OE Methods to Mitigate Specific Supply Chain Risks
Brendan J. Foran, The Aerospace Corporation

Electronic Component Authenticity via Electrical Signal Measurement and Artificial Intelligence with Deep Learning
Yung-Hsiao (Steven) Chung, Global ETS-USA; Feng Yu, Global ETS-USA; Junjie Xiong, University of South Florida; Stephen E. Saddow, University of South Florida

Supply Chain Security For Commercial FPGAs / SoCs / ACAPs
Steven McNeil, Xilinx Inc

AVX Corporation (1340-1355)
ES Components (1355-1410)
MicroCircuit Laboratories, LLC (1410-1425)
Q-Tech Corporation (1425-1440)

SMT Heat Pipes – A novel thermal control option
James Frasier, ATC

Characteristics of Practical CTE-Matched Composites for Electronics Thermal Management: Newest Materials and Comparative Analysis
Dave Saums, Principal, DS&A LLC

Reducing Energy Storage System Size & Weight in Aerospace Applications with Low Temperature Ultracapacitors
Mitch Koffel, Nanoramic Laboratories

High Reliability, Low Cost Semiconductors for New Space Opportunities
Brian Triggs, Semicoa

• Participate in an interactive Industry/Student panel where you can ask questions of seasoned professionals and explore career opportunities in the aerospace industry
• Trivia contest and awards ceremony
• Closing remarks by Tom Green

Click presentation title to review abstract. Final program subject to change.