A veteran-owned small business, TJ Green Associates, LLC is the recognized industry leader in consulting services, expert witness testimony, and training solutions related to the assembly and packaging of microelectronic components for high-reliability military, space and medical device applications.
Workmanship Standards for Advanced Hybrids, ICs and Microwave Assemblies
October 9, 2017 IMAPS 50th Anniversary SymposiumRaleigh, NC
Next generation Hybrids, Microcircuits, IMAs (Integrated Microwave Assemblies) and chip and wire PCBs all require a visual inspection step just prior to encapsulation or hermetic seal. This is a critical process step that requires a high degree of skill and understanding of what to look for and reject as part of the inspection process. This tutorial defines the inspection criteria based on traditional Mil-Std- 883 requirements in conjunction with industry accepted best commercial practices. High Mag inspection of ICs, MMICs and diodes along with Low mag die attach, wirebond and assembly related defects are reviewed in detail. Each student receives a 30 day access to the Workmanship Standards eBook: Hybrids, Microcircuits and RF/MMIC Modules, an online illustrated guide depicting photos of common workmanship defects as seen during production and each defect slide is tied to a particular page and referenced requirement in MIL-STD- 883/750. The students are exposed to a variety of defects and how the defects relate to the materials and process flow. Students learn what to look for as part of visual inspection and how to interpret and apply the very latest mil spec visual inspection criteria.