Stay ahead of your competition and keep your engineering and technical staff current by sharpening your skills with our leading-edge seminars that cover a variety of subject matter critical in the field of microelectronics packaging. These multi day seminars are usually held at a name hotel or professional training facility and are available to anyone in the industry. Our more popular seminars are scheduled multiple times around the country and overseas, there is sure to be a training session that will meet your organization’s needs.

  • Learn more, quicker, with intimate class sizes of no more than 12 students typically.
  • Our instructors possess years of experience in industry and pass on valuable lessons learned in the classroom.
  • With our training, your employees will become more skilled and better able to do their jobs — that means less revenue lost to careless mistakes.
  • Each course comes complete with its own hard copy student workbook and often includes a student test at the end.
  • Every student earns a training certificate upon successful completion of the seminar.
  • Subscribe to our Workmanship eBook and receive a discount on your next seminar.

To locate a seminar covering a subject or area of interest, select from the list of options below.

April 24, 2017
Bethlehem, PA

Introduction to Advanced Microelectronics Packaging Technologies

The instructor begins by broadly describing microelectronics packaging terminology and reviews the alphabet soup of acronyms used throughout the electronics industry; terms such as: DIP, LCC, QFN, BGA, CSP, Flip Chip, 3D, TSV, WLP, SIP ect The technology is then broken down by industry segments, beginning with high volume commercial packaging technology used in cell phones, tablets and handheld wireless devices, automotive, telecom, Internet of Things (IoT) and then progressing onto specialized packaging for low volume complex devices used in military hardware, Aerospace, Class III medical implants, Automotive, Commercial, Oil and Gas exploration as well as, RF microwave circuits, optoelectronics, LEDs and next generation packaging of MEMS and sensors. Special emphasis on advanced packaging technologies such as FO-WLP Fan-Out Wafer Level Packaging as shown in the photo on the left.

April 25-27, 2017
Bethlehem, PA

Wire Bonding Certification

This three-day course is a combination of classroom and “hands-on” exercises conducted at the wire bonder designed to teach the basics of manual gold ball and wedge wirebonding. The goal is to teach the process of wirebonding, which includes the wire, tool, machine settings and operation, work stage and operator skill. Especially important is how to troubleshoot a wire bond problem and get the process back on track. The instructor shares his numerous years of experience and provides insightful tips that help build confidence. Students develop a functional understanding of the wire bond process along with important quality and reliability considerations for hi rel military and medical products. In addition to bonding, the students also learn the important visual inspection criteria and how to properly perform wire pull/ball shear testing.

April 28, 2017
Bethlehem, PA

Pre Cap Visual Inspection per Mil-Std-883 (TM 2017)

Hybrids/MCMs/RF Microwave Modules all require a visual inspection step just prior to encapsulation or hermetic seal. This is a critical process step that requires a high degree of operator skill and understanding of what to look for and reject as part of the inspection process. “Hands-on” training at the microscopes will supplement the classroom lecture. The course is intended for quality assurance personnel, inspectors, lead operators and others responsible for inspection of the hardware prior to the final package sealing process.

3-day-seminar-advanced-process-cert

May 3-5, 2017
Boxborough, MA

Process Certification and Defect Recognition: Hybrids, Microcircuits and RF/MMIC Modules

This process certification is a must for quality, process, manufacturing engineers, designers and senior technicians and ideal for inspectors and line operators looking to broaden their knowledge base and understanding of visual inspection criteria and materials and processes used to assemble Hybrids, Microcircuits and RF MMIC Modules for high reliability Military and aerospace applications. Trained instructors with years of industry experience deliver the material in a straightforward and easy-to-understand format.

May 23-25, 2017
Boston, MA

Microwave Packaging Technology

Microwave Hybrids, MICs, RF MMIC modules all require a unique set of materials and processes necessary to achieve reliable operations in extreme military and commercial environments. This three-day course examines all aspects of microwave packaging from a practical perspective. The instructor shares valuable lessons learned from years of experience. Design issues, material trade offs, process selection are all covered in detail with the goal of imparting useful information to the students so they can return to the workplace better equipped to assemble and manufacture reliable microwave hybrids for military, space, and other high reliability commercial and medical device applications.

August 28, 2017
Bethlehem, PA

Pre Cap Visual Inspection per Mil-Std-883 (TM 2017)

Hybrids/MCMs/RF Microwave Modules all require a visual inspection step just prior to encapsulation or hermetic seal. This is a critical process step that requires a high degree of operator skill and understanding of what to look for and reject as part of the inspection process. “Hands-on” training at the microscopes will supplement the classroom lecture. The course is intended for quality assurance personnel, inspectors, lead operators and others responsible for inspection of the hardware prior to the final package sealing process.

Aug 29-31, 2017
Bethlehem, PA

Wire Bonding Certification

This three-day course is a combination of classroom and “hands-on” exercises conducted at the wire bonder designed to teach the basics of manual gold ball and wedge wirebonding. The goal is to teach the process of wirebonding, which includes the wire, tool, machine settings and operation, work stage and operator skill. Especially important is how to troubleshoot a wire bond problem and get the process back on track. The instructor shares his numerous years of experience and provides insightful tips that help build confidence. Students develop a functional understanding of the wire bond process along with important quality and reliability considerations for hi rel military and medical products. In addition to bonding, the students also learn the important visual inspection criteria and how to properly perform wire pull/ball shear testing.

Oct 31 - Nov 2, 2017
Pasadena, CA

Microwave Packaging Technology

Microwave Hybrids, MICs, RF MMIC modules all require a unique set of materials and processes necessary to achieve reliable operations in extreme military and commercial environments. This three-day course examines all aspects of microwave packaging from a practical perspective. The instructor shares valuable lessons learned from years of experience. Design issues, material trade offs, process selection are all covered in detail with the goal of imparting useful information to the students so they can return to the workplace better equipped to assemble and manufacture reliable microwave hybrids for military, space, and other high reliability commercial and medical device applications.

Nov 29 - Dec 1, 2017
Anaheim, CA

Wire Bonding Certification

This three-day course is a combination of classroom and “hands-on” exercises conducted at the wire bonder designed to teach the basics of manual gold ball and wedge wirebonding. The goal is to teach the process of wirebonding, which includes the wire, tool, machine settings and operation, work stage and operator skill. Especially important is how to troubleshoot a wire bond problem and get the process back on track. The instructor shares his numerous years of experience and provides insightful tips that help build confidence. Students develop a functional understanding of the wire bond process along with important quality and reliability considerations for hi rel military and medical products. In addition to bonding, the students also learn the important visual inspection criteria and how to properly perform wire pull/ball shear testing.

3-day-seminar-advanced-process-cert

Dec 4-6, 2017
Pasadena, CA

Process Certification and Defect Recognition: Hybrids, Microcircuits and RF/MMIC Modules

This process certification is a must for quality, process, manufacturing engineers, designers and senior technicians and ideal for inspectors and line operators looking to broaden their knowledge base and understanding of visual inspection criteria and materials and processes used to assemble Hybrids, Microcircuits and RF MMIC Modules for high reliability Military and aerospace applications. Trained instructors with years of industry experience deliver the material in a straightforward and easy-to-understand format.