Home Page | TJ Green Associates, LLC -- Training and Consulting for Military, Space and Medical Microelectric Devices

Mission-critical microelectronic device failures at the system level can be prevented with careful and knowledgeable inspection and correction during the production process. TJ Green Associates is uniquely experienced in all aspects of microelectronic device assembly, inspection, and defect recognition. We provide training and consulting services that will enable you to identify defects and determine the appropriate cause and corrective actions in order to maximize production yield and minimize device failures in the field.

A veteran-owned small business, TJ Green Associates provides teaching and consulting services to companies around the world with expertise in materials and processes used to assemble hybrids, multichip modules, RF/MMIC modules, MEMS, medical implants, optoelectronics, and other types of packaged microcircuits.

Specific areas of expertise include:

Hermeticity and “Near Hermetic“ Packaging
Visual inspection per Mil-Std-883
Wirebond process development and failure analysis
Die bond processes including MMIC AuSn attach
Failure analysis and root cause identification
Package design and material selection
Thick and thin film substrate fabrication
Advanced Packaging
Expert Witness

Our teaching and consulting services include:

Training ranges from custom in-plant offerings to hands-on courses on the factory floor to public courses, including annual east and west coast process certification training.

Courses range from one to four days, and cover a variety of topics, including Wirebond Process Certification, Defect Recognition, Hermeticity Testing, and much more. All are offered as public courses and on-site training; custom courses available upon request.

Consulting services cover everything from materials and process development to technical writing and presentations, and to serving as an expert witness.