Stay ahead of your competition and keep your engineering and technical staff current by sharpening your skills with our leading-edge seminars that cover a variety of subject matter critical in the field of microelectronics packaging. These multi day seminars are usually held at a name hotel or professional training facility and are available to anyone in the industry. Our more popular seminars are scheduled multiple times around the country and overseas, there is sure to be a training session that will meet your organization’s needs.

  • Learn more, quicker, with intimate class sizes of no more than 12 students typically.
  • Our instructors possess years of experience in industry and pass on valuable lessons learned in the classroom.
  • With our training, your employees will become more skilled and better able to do their jobs — that means less revenue lost to careless mistakes.
  • Each course comes complete with its own hard copy student workbook and often includes a student test at the end.
  • Every student earns a training certificate upon successful completion of the seminar.
  • Subscribe to our Workmanship eBook and receive a discount on your next seminar.

To locate a seminar covering a subject or area of interest, select from the list of options below.

3-day-seminar-wire-bond-sold-out

December 11 - December 13, 2018
Anaheim, CA

Wire Bonding Certification

This three-day course is a combination of classroom and “hands-on” exercises conducted at the wire bonder designed to teach the basics of manual gold ball and wedge wirebonding. The goal is to teach the process of wirebonding, which includes the wire, tool, machine settings and operation, work stage and operator skill. Especially important is how to troubleshoot a wire bond problem and get the process back on track. The instructor shares his numerous years of experience and provides insightful tips that help build confidence. Students develop a functional understanding of the wire bond process along with important quality and reliability considerations for hi rel military and medical products. In addition to bonding, the students also learn the important visual inspection criteria and how to properly perform wire pull/ball shear testing.

1-day-seminar-pre-cap

December 14, 2018
Pasadena, CA

Pre Cap Visual Inspection per Mil-Std-883 (TM 2017)

Hybrids/MCMs/RF Microwave Modules all require a visual inspection step just prior to encapsulation or hermetic seal. This is a critical process step that requires a high degree of operator skill and understanding of what to look for and reject as part of the inspection process.  Hybrid and monolithic die attach (eutectic/epoxy), wirebond, foreign material, active IC and MMIC die inspect and passives all covered in great detail per the applicable MIL-STD-883 and applicable MIL-STD-750 inspection criteria.  Class attendees receive a 30 day subscription to the Workmanship Standards eBook: Hybrids, Microcircuits and RF/MMIC Modules.

3-day-seminar-wire-bond

March 5 - March 7, 2018
Bethlehem, PA

Wire Bonding Certification

This three-day course is a combination of classroom and “hands-on” exercises conducted at the wire bonder designed to teach the basics of manual gold ball and wedge wirebonding. The goal is to teach the process of wirebonding, which includes the wire, tool, machine settings and operation, work stage and operator skill. Especially important is how to troubleshoot a wire bond problem and get the process back on track. The instructor shares his numerous years of experience and provides insightful tips that help build confidence. Students develop a functional understanding of the wire bond process along with important quality and reliability considerations for hi rel military and medical products. In addition to bonding, the students also learn the important visual inspection criteria and how to properly perform wire pull/ball shear testing.