Utilize our popular prerecorded webinars on your own, to learn electronically, or in conjunction with our Seminars and In-plant training to further enhance employee training.

Browse through our webinars below and click to learn more!

Webinar Sample

Die attach and wirebond are still the fundamental skill sets required to assemble hybrids, microwave modules and other types of packaged microelectronic modules. This wirebonding webinar is designed to highlight critical material and process issues and emphasize the important steps needed to assemble a quality product. The instructor relies on years of experience and clear graphics to talk through the technical details of epoxy and eutectic solder attach of silicon and delicate gallium arsenide chips. Interconnecting these state of the art devices to the outside world involves gold and aluminum wirebonding, which must be performed to exacting standards.

Hermeticity of microelectronic packages and hermeticity testing techniques continue to be of critical importance to the packaging community. Specifically, in the area of hybrids, microwave modules, MEMS, Class III medical implants, optoelectronic devices, sensors and other types of packaged components for the aerospace and medical device industry.

Hybrids, microwave modules and Class III medical implants along with other complex microelectronic assemblies all require a lot of thinking and design trade offs prior to full scale manufacturing. There have been many instances where designers have unknowingly placed tremendous burdens on manufacturing that translate into yield loss, production delays, reliability problems and unhappy customers.  This hybrid microwave design webinar is intended to sensitize designers to the issues important to manufacturing.  Hybrid circuit designers must “design with the process in mind”.  Any circuit that can’t be assembled within reasonable cost and schedule constraints is a bust.  Each session touches and summarizes important lessons learned based on actual experience.

This microelectronics packaging webinar is intended for individuals unfamiliar with microelectronics packaging technology. The first portion broadly describes packaging terminology and reviews the myriad of acronyms used throughout the electronics industry. The instructor then breaks down the technology in terms of industry segment, beginning with low volume complex hermetic packages for the military use, to the latest developments in commercial microelectronics packaging for cell phones and handheld wireless devices. Lots of pictures along with simple explanations will help a new manager or engineer understand the technology drivers and key aspects of microelectronic packaging technology.

Packages made from polymeric materials as opposed to traditional hermetic seals (i.e. metal, ceramic etc) require a different approach from a hermeticity testing standpoint. The problem is now one of moisture diffusion through the barrier and package interfaces, which is different that water vapor permeating a crack in a glass to metal interface. A brief review of the techniques and methods to evaluate a “non-hermetic” approach is presented along with a discussion of the pitfalls and issues of TM 1014 and TM 1018 as applied to a “near hermetic package”.

Visual defects that go unnoticed during assembly operations can cause field failures in military and high rel commercial and medical products. This fast paced visual inspection webinar is intended to educate operators, inspectors and QEs about the importance of identifying and eliminating visual defects that result from assembly operations. The webinar is focused on critical defects seen at incoming, Pre Cap and external visual inspection in accordance with MIL-STD-883 and MIL-STD-750 inspection criteria.

Many companies waste countless man-hours and resources resolving problems on the manufacturing floor. Much of this waste is due to inadequate training of the responsible engineers and technicians working on the factory floor. This course is designed to teach the fundamental materials and processes used in microelectronics manufacturing and develop in the student an understanding of the relevant visual inspection criteria.