CMSE Logo23rd Annual Components for Military & Space Electronics Conference & Exhibition

April 16-18th, 2019

Four Points by Sheraton (LAX)
Los Angeles, California

Advanced Program

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Tuesday, April 16th – Tutorials

8:00am – 12:00pm

Copper Wirebonding – A Technology Review
Mukul Saran, Texas Instruments

This tutorial will provide a comprehensive review of the current status of Cu-wirebond based on lessons from non-military/aerospace industries. It will cover a wide range of materials, starting with the historical aspects and ending with a review of the latest developments in the field. Much of the tutorial will focus on the manufacturability, current qualification practices and reliability of Cu-wirebonded products. With a better understanding of the issues and the current status, the attendees will have the tools to better assess risks in their own applications.

1:00pm – 5:00pm

Advanced Integrated Circuit Packaging and Reliability Issues
Richard Rao, Ph.D., Microchip Technology, Inc.

This short course provides a holistic understanding of all aspects of reliability failure mechanisms of an advanced IC packages. It covers advanced packaging technologies such as Flip Chip BGA, Wafer Level packages, 2.5D/3D Packages and Cu pillar and wirebonding; and their reliability failure modes and design solution.

1:00pm – 5:00pm

Moisture in Microelectronics… Volatiles Control in Hermetic Electronic Components
Thomas Green, TJ Green Associates LLC
Robert Lowry, Electronic Materials Consultant

The tutorial includes a basic review of the Mil Spec test methods in place to prevent moisture related failures in military and other systems where functional reliability is of utmost importance (e.g. IC’s, Hybrids, MEMs, Class III Medical Implants, Optoelectronics, etc). It’s intended to enlighten the student on the negative, and sometimes catastrophic, consequences of too much moisture inside a hermetic enclosure. The class begins with a definition of hermeticity and a description of the latest hermeticity test methods in MIL-STD-883 TM 1014 and associated mil/space spec limits, along with IGA (Internal Gas Analysis) and the latest developments in TM 1018. Moisture failure case studies with significant consequences in terms of cost, schedule, loss of mission and system downtime will be reviewed.

8:00am – 5:00pm

Passive Component Reliability Workshop
Dr. Yuri Freeman, Kemet
John Marshall, AVX
Chris Reynolds, AVX
Scott Harris, Vanguard Electronics

The Passive Component Reliability Workshop course will be presented in three sessions covering Tantalum & Electrolytic Capacitors (Dr. Yuri Freeman, Kemet), MLCC & EMI filters (John Marshall, AVX) and SuperCapacitors, Film & Thin film capacitors (Chris Reynolds, AVX). Students will gain an understanding of capacitor construction and how performance characteristics are affected by time, temperature, voltage and frequency. End applications are discussed along with reliability expectations, common failure modes and de-rating methods for increased lifetime performance. Processing guidelines are presented and the availability and use of simulation models is shown.
The Inductor performance, reliability and selection session will be taught by (Scott Harris, Vanguard Electronics). This course will outline the basics of magnetics from an RF and power inductor and transformers point of view. Material performance, core types and properties along with wire types, winding techniques and patterns are shown relative to their impact upon performance. Reliability predictions and levels are discussed along with a preview of emerging technologies and device simulation techniques.
Resistor theory, performance & reliability will be taught by (TBD_ Vishay). Resistor types and materials will be discussed relative to component performance. Device characteristics and performance relative to time, temperature, frequency and power are discussed. Heat transfer means and noise characteristics outlined. Reliability expectations and recommended applications are given.

Wednesday, April 17th and Thursday, April 18th – Conference and Exhibits

Keynote Speakers

MLCC Shortages: FY 2019 Tier-To-Tier replacement Strategies and Alternative Reference Design Solutions
Dennis Zogbi, Paumanok Publications, Inc.

This global market presentation offers a fresh look at the current market shortage in multilayered ceramic chip capacitors (MLCC) and offers the audience solutions based upon a tier-to-tier analysis of all known MLCC vendors by Case Size; followed by additional suggestions for solutions to the MLCC shortage based upon alternative capacitor case sizes for alternative reference designs…read more  

Called a “National Treasure” by the former undersecretary of defense- Dennis Zogbi is the founder and lead researcher at Paumanok Publications and the author of more than 300 studies on the global market for passive electronic components and related raw materials. Mr Zogbi advises many of the largest hedge funds in the world in the area of mass produced and specialty electronic components and speaks on Wall Street on a monthly basis. He is dialed in to primary and secondary resources worldwide and has deep contacts and sticky customer relationships with companies, agencies and institutions in the USA, Japan, Germany, Korea, France, greater China, UK, central Africa and Canada. With his work with Leon Hamiter and CARTS MR Zogbi has presented market intelligence reports to the passive components industry in multiple locations worldwide. Mr Zogbi has also been Keynote speaker at EDS, ECIA Stats, CARMs and multiple other industry events. Mr Zogbi has written Marketeye for TTI/Berkshire Hathaway since 1999. Today Mr Zogbi will be discussing the shortage of MLCC and how it fits into the 30 year big data set that Paumanok has provided the global markets since 1988.

Flexibility and Innovation in Military Systems
Jonathan Ahlbin, MDA

In an era of near-peer competition, the development of military systems need to become faster. To achieve this goal, industry and government need to use innovative collaborative processes to ensure the systems meet performance, reliability, and availability requirements…read more  

Dr. Jonathan Ahlbin is the Missile Defense Agency, Division Chief for Parts, Materials, and Processes Engineering (Acting) and the Branch Lead for EEE Parts Engineering. In these roles, he is responsible for implementing and managing the team that oversees all MDA BMDS parts, materials, and process requirements and policies that include Counterfeit Parts, Part Selection and procurement, Screening & Qualification Criteria, Failure Analysis, Radiation Hardness Assurance, and Materials Engineering. Dr. Ahlbin has a BE, MS, and PhD in Electrical Engineering all from Vanderbilt University. He has published over 50 papers in the areas of microelectronic reliability, radiation survivability, and supply chain risk management. Previously, Dr. Ahlbin worked for USC-ISI as a Senior Electrical Engineer supporting research and development programs for DARPA, IARPA, and DTRA.

Panel Discussion: Mil/Aerospace Talent Gap… How to Attract and Retain Young Engineers (1.5 Hrs)

Panelists:
Rick Rodriguez, Component Engineering Mgr., Raytheon Missile Systems
Roz Morrison, HR Manager, Raytheon Missile Systems
Dr. Michael Hamilton, Auburn University, Director, Alabama Micro/Nano Science & Technology Center

Moderator:
Tom Green, TJ Green Associates LLC

The purpose of this open panel discussion is to bring into focus divergent views on the industry wide problem of an aging workforce in the Military and Aerospace. The “gray beards”, as they’re known, are leaving our industry and a large gap in both talent and experience has emerged that is slowing our ability to grow and meet the challenges of building reliable next generation weapon systems…read more

Session #1: Passive Components for Military and High Rel Space Systems – Presentations

Termination cracking in MIL-PRF-55342 Chip Resistors
Mike Cozzolino, Raytheon Company

A Case Study of Grain Slippage in Wirebound RTDs
Mike Cozzolino, Raytheon Company

Embedded Thin Film Nickel-Phosphorus Resistors
Bruce Mahler, Ohmega Technologies, Inc.

SCHURTER Fuses for Space
Bruno Zemp, Schurter Electronic Components

Session #2: Advanced Packaging for Military and Aerospace – Presentations

2.5/3D Packaging NEPP ETW
Doug Sheldon, NASA Jet Propulsion Laboratory

19500 Non Hermetic
Benny Damron, NASA/Jacobs Space Exploration Group (JSEG)

Session #3: RF and Power GaN Technology – Presentations

Space Qualification of GaN HEMTs -Guidance Document Announcement
John Scarpulla, The Aerospace Corporation

Power Enhancement Mode GaN HEMT update
Jim Larrauri, Freebird Semiconductor

Eutectic Die Attach for High Power GaN Devices
Casey Krawiec, StratEdge Corporation

Session #4: Component Technology Reliability Issues and the Trusted Supply Chain – Presentations

RGA & Lid-Seal: Waivers, Woes & Wants
Andy Moor, Northrop Grumman Mission Systems

Lid Voiding Hermeticity
Rich Richarson, MicroCircuit Laboratories

Predictive Maintenance
Ed Dodd, DfR Solutions

Biodegradable Electronics Packaging
Bob Lowry, Electronic Materials Consulting