TJ Green Associates, LLC


“Near-Hermetic” Packaging Concepts for Military and Medical Devices

(2 Sessions)

 

Webinar Course Description:

 

Packages made from polymeric materials as opposed to traditional hermetic seals (i.e. metal, ceramic, etc.) require a different approach from a hermeticity testing standpoint. The problem is now one of moisture diffusion through the barrier and package interfaces, which is different than water vapor permeating a crack in a glass to metal interface. A brief review of the techniques and methods to evaluate a "non-hermetic" approach is presented along with a discussion of the pitfalls and issues of TM 1014 and TM 1018 as applied to a “near hermetic package.”

 

 

Session I: Thursday September 15th  1100 AM EST

 

Session Title:  Near Hermetic Part 1

 

Cavity style packages made from polymeric materials such as LCP or Teflon or other types of packages that are coated with a polymer as opposed to traditional hermetic seals require a different approach from a leak testing standpoint.  The problem is now one of moisture diffusion through the polymer or barrier. 

 

Military and Medical Market Drivers
“Near Hermetic” cavity package defined
The “Hermeticity Myth”  
MIL-STD-883 TM 1014 and TM 1018 Do they apply? 

 

 

Session II: Friday September 16th  1100 AM EST

 

Session Title:  Near Hermetic Part 2

 

A brief review of the techniques and methods to evaluate a "non-hermetic" approach is presented along with the fundamental theory. 

 

Fick’s Law of Moisture Diffusion
WVTR, TGA, and moisture diffusion coefficients
Moisture Sensing (wired and wireless sensors)
How to qualify a “near hermetic “ package

 

 

About the Instructor:

 

Mr. Thomas Green is an independent consultant and the Technical Director at TJ Green Associates LLC, a Veteran owned small business. He has over 28 years’ experience in the microelectronics industry and has worked at Lockheed Martin Astro Space and USAF Rome Laboratories. At Lockheed he was a Staff engineer responsible for the materials and manufacturing processes used in building custom high reliability space qualified microcircuits for military and commercial communication satellites. Tom has demonstrated expertise in seam sealing and leak testing processes. He has conducted experiments and presented technical papers at NIST (National Institute Standards and Technology) and IMAPS on leak testing techniques and optimization of seam welding processes through statistical DOE methods. He has experience with OLT (Optical Leak Technology) and CHLD (Cumulative Helium Leak Detection). Tom is an active IMAPS member and has a B.S. in Materials Engineering from Lehigh University and a Masters from the University of Utah.

 

Instructor Biography


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