Hermetic Sealing and Testing of Small Volume MEMS Packages
(2 sessions)
Webinar Course Description:
Reliable packaging of Microelectromechanical Systems (MEMS) requires the ability to create and maintain a suitable inert atmosphere or vacuum inside the package cavity for the expected lifetime of the device. Traditional hermetic ceramic/metal packages are being replaced by wafer level packaging techniques, which present unique challenges from a hermeticity testing perspective. This webinar begins with a brief overview of traditional hermetic sealing processes along with wafer level MEMS packaging processes. In some cases near-hermetic packages, such as LCP are suitable replacements for hermetic cavities. Testing of small cavity MEMS packages according to the traditional MIL-STD-883TM 1014 requirements may not be sufficient to guarantee reliable operation. Difficulties and limitations in fine leak testing of small volume packages will be addressed. Recent advances in Optical Leak Testing (OLT), Cumulative Helium Leak Detection (CHLD) and Radioisotope KR 85 along with other hermeticity techniques are reviewed in light of the new, tighter leak rate hermeticity specifications. Moisture ingress is of primary concern for a small volume MEMS cavity packages. Moisture level vs. surface area to volume ratio is an important concept, along with material outgassing and the potential to mitigate these problems with getters. These along with other critical MEMS packaging issues are addressed in this two part webinar.
Session I: Thursday November 17th 1100 AM EST
Session Title: Hermetic MEMS Part 1
MEMS Packaging Overview
Traditional metal and ceramic seal processes
Hermetic wafer level MEMS packaging processes
“Near Hermetic” package seal options
Review of Hermeticity Testing per MIL-STD-883 TM 1014 Seal
Hermeticity leak rate specifications for MEMS
Session II: Friday November 18th 1100 AM EST
Session Title: Hermetic MEMS Part 2
MEMS Hermeticity Testing Options
OLT, CHLD, and Kr-85 hermeticity testing methods
Embedded moisture sensors
MEMS Hermeticity Testing Issues
Moisture level vs. surface area to volume ratio
Expected lifetimes in the field
Use of getters as a mitigation strategy
About the Instructor:
Mr. Thomas Green is an independent consultant and the Technical Director at TJ Green Associates LLC, a Veteran owned small business. He has over 28 years’ experience in the microelectronics industry and has worked at Lockheed Martin Astro Space and USAF Rome Laboratories. At Lockheed he was a Staff engineer responsible for the materials and manufacturing processes used in building custom high reliability space qualified microcircuits for military and commercial communication satellites. Tom has demonstrated expertise in seam sealing and leak testing processes. He has conducted experiments and presented technical papers at NIST (National Institute Standards and Technology) and IMAPS on leak testing techniques and optimization of seam welding processes through statistical DOE methods. He has experience with OLT (Optical Leak Technology) and CHLD (Cumulative Helium Leak Detection). Tom is an active IMAPS member and has a B.S. in Materials Engineering for Lehigh University and a Masters from the University of Utah.
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