Hermeticity, MEMS, and Near Hermetic Webinars

Signing up for a targeted interactive educational webinar is a great way to educate oneself and stay on top of advancing technology. Periodically, we run live educational webinars and focused sessions on specialized topics of interest. This coming year we focus on visual inspection, wirebonding and a new three part introductory series designed for folks just starting out in the field of microelectronic packaging. Each live session is about 50 minutes of lecture followed by live Q&A.

Cost: $199/each session

Class Time: 1100 AM -1200 PM Eastern time (unless otherwise noted)

VIEW SAMPLE WEBINAR (free download)

Log-in details and soft copy of courses notes will be sent along with the webinar course confirmation upon receipt of payment.Can’t make it to class? Request the recorded download at no additional charge and watch it at your convenience.

2012 Webinar Schedule (Spring Term)

28-30 March Introduction to Microelectronics Packaging (3 sessions)

This three part webinar series is intended for individuals unfamiliar with microelectronics packaging technology. The first session broadly describes packaging terminology and reviews the myriad of acronyms used throughout the electronics industry. The instructor then breaks down the technology in terms of industry segment, beginning with low volume complex hermetic packages for the military use, to the latest developments in commercial microelectronics packaging for cell phones and handheld wireless devices. Lots of pictures along with simple explanations will help a new manager or engineer understand the technology drivers and key aspects of microelectronic packaging technology.

Full Webinar Outline

25-27 April Visual Inspection of Microelectronic Assemblies (3 sessions)

Visual defects that go unnoticed during assembly operations can cause field failures in military and high rel commercial and medical products. This fast paced three part webinar series is intended to educate operators, inspectors and QEs about the importance of identifying and eliminating visual defects that result from assembly operations. The webinar is focused on critical defects seen at incoming, Pre Cap and external visual inspection in accordance with MIL-STD-883 and MIL-STD-750 inspection criteria.

Full Webinar Outline

29 May-1 June Die Bond Wirebond…..Back to Basics (4 sessions)

Die attach and wirebond are still the fundamental skill sets required to assemble hybrids, microwave modules and other types of packaged microelectronic modules. This condensed four part webinar is designed to highlight critical material and process issues and emphasis the important steps needed to assemble a quality product. The instructor relies on years of experience and clear graphics to talk through the technical details of epoxy and eutectic solder attach of silicon and delicate gallium arsenide chips. Interconnecting these state of the art devices to the outside world involves gold and aluminum wirebonding which must be performed to exacting standards.

Full Webinar Outline