TJ Green Associates has published the following papers. All publications are available upon request.

• “Technology Insertion and Process Improvements - A Case Study,” Proceedings of the International Society of Hybrid Microelectronics (1997) Philadelphia, PA
• “Using DOE to Reduce Costs and Improve the Quality of Microelectronic Manufacturing Processes,” Proceedings of the International Society of Hybrid Microelectronics (1994) Boston, MA
• “Using DOE to Optimize Hermetic Package Seam Welding,” Proceedings of the International Society of Hybrid Microelectronics (1992) San Francisco, CA
• “Helium Fine Leak Testing Using the Berquist Method,” presented at the RADC/NIST Moisture Workshop (1992) Gaithersburg, MD
• “Air Force Field Failure Return Program,” International Reliability Physics Symposium (IRPS) (1988) Monterey, CA
• “Air Force Field Failure Return Program,” Government Microcircuit Applications Conference (GOMAC) (1989) Orlando, FL
• “A Review of EOD/ESD Failures from AF Avionics Applications,” EOS/ESD Symposium (1988). Also selected as one of the ten best ESD papers from the 1980s and published in a book form.
• “Practical Guide to TM 1014 (SEAL)” – Free Download