Singapore Microelectronics Training
Singapore Training Week
Jan 28 - Feb 1, 2013
TJ Green LLC is proud to present an entire week of public courses as part of their 2013 Singapore training event. Pre-Cap Visual Inspection, Wirebonding Theory & Practice and the Microwave Packaging course will all be offered as part of this week long event commencing on January 28, 2013 and ending on Feb 1, 2013. Train with TJ Green LLC during the day, and enjoy the beautiful city of Singapore at night.
15% Discount on course fee for SSIA members
Microwave Packaging Technology
Mon Jan 28 - Wed Jan 30, 2013
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Course Fee: $2,300 per student USD
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This course is intended as an introductory to intermediate level course for process engineers, designers, quality engineers, and managers responsible for design and manufacture of microwave hybrids and microwave packaging technology. This three day course examines all aspects of microwave packaging from a practical perspective. The instructor shares valuable lessons learned from years of experience. Design issues, material trade offs and process selection are all covered in detail. Microwave Design for Manufacturbility DFM concepts are introduced and reinforced throughout the course.
Register Now...Space is Limited!
Click here for registration form
Click here for instructor Bio |
Wire Bonding Theory & DOE
Thursday Jan 31,2013
Course Fee: $795 per student USD. |
This is an intense one day course that covers the theory and practical aspects of forming a reliable wirebond interconnect. A special emphasis is placed on the materials, process and reliability concerns of creating a long lasting wirebond interconnect. All aspects of fine wire ball and wedge bonding and the associated testing and inspection requirements will be addressed with plenty of time for questions. Including a review of how to set up and run a Design of Experiments to optimize the bonding process.
Register Now...Space is Limited!
Click here for registration form.
Click here for instructor Bio |
Pre Cap Visual Inspection Per Mil-Std-883
Friday Feb 1, 2013
Course Fee: $795 per student USD. |
Hybrids/MCMs/RF Microwave Modules all require a visual inspection step just prior to encapsulation or hermetic seal. This is a critical process step that requires a high degree of skill and understanding of what to look for and reject as part of the inspection process. This course defines the inspection criteria based on traditional Mil Spec requirements in conjunction with industry accepted best commercial practices. Over 200 color photographs of actual production defects are reviewed and discussed in detail. The students are exposed to a variety of defects and how the defects relate to the materials and process flow.
Register Now...Space is Limited!
Click here for registration form.
Click here for instructor Bio |
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