Access to Webinar: Hermetic Sealing and Testing of Small Volume MEMS Packages, Session 2

Webinar Description:

Reliable packaging of Microelectromechanical systems (MEMS) requires the
ability to create and maintain a suitable inert atmosphere or vacuum
inside the package cavity for the expected lifetime of the device.
Traditional hermetic ceramic/metal packages are being replaced by wafer
level packaging techniques, which present unique challenges from a
hermeticity testing perspective. This webinar begins with a brief 
overview of traditional hermetic sealing processes along with wafer
level MEMS packaging processes . In some cases near-hermetic packages,
such as LCP are suitable replacements for hermetic cavities. Testing of
small cavity MEMS packages according to the traditional MIL-STD-883TM
1014 requirements may not be sufficient to guarantee reliable operation.
Difficulties and limitations in fine leak testing of small volume
packages will be addressed. Recent advances in Optical Leak Testing
(OLT), Cumulative Helium Leak Detection (CHLD) and Radioisotope KR 85
along with other hermeticity techniques are reviewed in light of the
new, tighter leak rate hermeticity specifications. Moisture ingress is
of primary concern for a small volume MEMS cavity packages. Moisture
level vs. surface area to volume ratio is an important concept, along
with material outgassing and the potential to mitigate these problems
with getters. These along with other critical MEMS packaging issues are
addressed in this two part webinar.

Session 2

MEMS Hermeticity Testing Options

OLT, CHLD and Kr-85 hermeticity testing methods
Embedded moisture sensors

MEMS Hermeticity Testing Issues
Moisture level vs. surface area to volume ratio
Expected lifetimes in the field
Use of getters as a mitigation strategy