Curriculum Vitae

Thomas J Green, Principal

TJ Green Associates LLC

Thomas J Green is the owner and principal of TJ Green Associates LLC.   Founded in 2002, TJ Green Associates is a veteran-owned small business providing microelectronics teaching and consulting services to companies around the world with expertise in materials and processes used to assemble hybrids, multichip modules, RF/MMIC microwave modules, MEMS, Class III medical implants, optoelectronics, and other types of packaged microcircuits.  TJ Green also provides expert witness services for hermeticity failures. 

Teaching Experience:

Designs, develops, and teaches professional engineering courses related to microelectronics (Hybrids, MCMs, and microwave  modules) materials and processes for process engineers, designers, quality engineers, inspectors, and technicians. With 30 years of experience in industry, academia, and the DoD, Tom is uniquely qualified to teach and guide students in quality workmanship practices and process engineering curriculum.
•    Developed over twenty hours of web based course materials for internal use at a major aerospace company. On line training was targeted to designers, process engineers, component engineers and QEs in the high rel military and aerospace community.
•    Each year delivers over 15 hours of publically available training webinars targeting the microelectronics packaging community see http://www.tjgreenllc.com/webinars  for more details.
•    Teaches the industry’s only full day public hermeticity course, “Hermeticity Testing, RGA, and Near Hermetic Packaging Concepts,” available twice a year through the International Microelectronics and Packaging Society (IMAPS).
•    In 2008 developed and taught the first IMAPS “Lunch and Learn” Webinar titled, “Hermeticity Packaging Concepts,” attended by 28 students worldwide.
•    Teaches a variety of multi-day industry short courses at major companies around the globe including Sandia National Labs, NASA/JPL, BAE Systems, Lockheed Martin, Northrop Grumman, MIT Draper Labs, MITEQ Inc, L-3 Communications, ILC/DDC, and many others.
•    Developed the four day “Process Certification and Defect Recognition for Hybrids, Microcircuits, and RF/MMIC Modules,” and in close cooperation with engineers from Lockheed Sanders developed the associated Workmanship Standards (250 color photos).
•    “Process Certification and Defect Recognition” taught in plant at multiple locations including Lockheed Martin, Denver, CO, and at Honeywell KCP, Kansas City, MO
•    Recently taught a “Wirebonding Certification”  course in plant at Sandia Labs
•     “Hermeticity Testing, RGA and Near Hermetic Packaging Concepts” a professional development course taught at the IMAPS National Symposium for each of the past seven years
•    International Webinar series on “Hermeticity for Medical and Military”, a three part series attended by thirty five students worldwide.
•    Conducted three weeks of in plant training and skills assessment  for over seventy operators and inspectors at major microwave component supplier on Long Island.  “Hands-on” training program required development of a training piece, evaluation and testing to evaluate critical skills for HR dept

Consulting Projects:

• Worked with a major military OEM to identify cause and corrective action of a hermeticity qualification failure
• Drafted internal workmanship practices for a major LED supplier
• Hermeticity evaluation, testing, and product development for a Class III medical implant
• Correlation testing of TM 1014 Hermeticity test techniques
• Characterized the reliability and moisture ingress in near hermetic cavity-style Teflon¨ laminate packages for RF and telecom applications
• Developed hermeticity test techniques using both wired and wireless moisture sensors to determine real time moisture build up inside a hermetic package. Results published at IMAPS and the Minnowbrook Conference
• Drafted the most recent revision to Mil-STD-883 TM 1014.11(Seal). Incorporated Optical Leak Test Method (OLT)  into the specification.
• Regularly attend the Joint Electron Device Engineering Council (JEDEC) meetings (3 times a year) in support of Hermeticity Testing per TM 1014 and Residual Gas Analysis (RGA) per TM 1018
• Investigated and developed processes to minimize hydrogen outgassing in hermetic cavities and minimize moisture problems in microelectronic packages
• Worked with several companies to revise quality documentation and prepare company for the DSCC Military Qualified Manufacturers Listing (QML) and associated audits.
• Analyzed and identified the failure mechanism for a heavy aluminum wire to thick film gold process, a critical space system qualification test failure
• Drafted and delivered a complete Hybrid Microelectronics Workmanship and Quality Manual for the NASA Jet Propulsion Laboratory in Pasadena, CA
• Developed a critical 1 mil high temp wirebond process with full qualification and failure analysis
• Developed a MMIC wirebond process with complete documentation
• Developed heated plasma cleaning processes for laser cut diamond substrates
• Failure analyzed and implemented new processes for a 10 gigabit optical modulator line
• Optimized a gold/tin eutectic process using the Palomar 3500 die bonder, GaN chip to CMC heat spreader
• Studied outgassing behaviors of epoxies used in optoelectronics for high reliability telecommunications applications
• Conducted a series of DOEs to optimize Au ball bonding to copper-clad PTFE
• Successfully diagnosed and resolved a major heavy wire (7 and 15 mil aluminum) problem with a commercial power module manufacturer. Three-month consulting project included problem identification via analytical methods and wirebond optimization experiments
• Installed RF thin film teaching laboratory overseas for the US State Department
• Developed and taught an ESD (electrostatic discharge) training course at Ft. Meade, MD, Honda of America, and other major corporations
• Installed an advanced Siemens pick-and-place line at the local college and taught numerous Siemens field service engineers how to operate and program the machines
• Developed a gold/tin die attach process for a 60 GHz SSPA
• Involved in numerous FA/process improvement activities: capacitor epoxy attach processes, seam welding issues, cracked glass seals, cratering of GaAs wirebond pads
• Conducted and analyzed numerous statistically designed experiments (DOE), which increased first pass yield, reduced costs, and improved product quality

Previous Employment:

• Adjunct Professor at the National Training Center for Microelectronics, Bethlehem, PA (1996-2002).
• Retired Lieutenant Colonel, United States Air Force Reserve (26 years combined active and reserve duty). As a reservist spent ten plus years working in a technical capacity in a microelectronics group at a large government Defense Agency.
• Lockheed Martin Senior Staff Engineer, Denver, CO and Newtown PA (1989-1996). Responsible for materials and manufacturing processes, including assembly and hermetic seal processes, used in building custom high reliability space qualified microcircuits (hybrids, MCMs, and RF modules) for military and commercial communication satellites.
• Reliability Engineer at USAF Rome Laboratories (1985-1989). Worked in a Reliability Physics group, analyzed component failures from AF avionic equipment, along with providing technical support for a variety of Mil specs and standards including , MIL-PRF-38534 and MIL-STD-883.
• Flight Test Engineer at the 6545th Test Group Hill AFB, Utah, (1982-1985). Provided technical engineering support and conducted research, test, and development of unmanned aerial vehicles (UAVs) for USAF military operations.

Recent Examples of Teaching Engagements:

• Pre Cap Visual Inpsection training Aeroflex
• Developed and taught a series of in plant technical webinars at Lockheed Newtown PA Fall 2011
• "Process Certification and Defect Recognition" taught in plant to numerous engineers and technicians on location at Lockheed Martin, Denver, CO, and at Honeywell KCP, Kansas City, MO, in the Fall of 2010
• "Wirebonding Certification" training in plant Sandia Labs 2010
• "Near Hermetic Packaging Concepts for Military and Medical Devices" a professional development course taught at the International Device Packaging Conference in Scottsdale, AZ, March 2010
• "Hermeticity Testing, RGA and Near Hermetic Packaging Concepts" a professional development course taught at the IMAPS National Symposium for each of the past seven years
• International Webinar series on "Hermeticity for Medical and Military", a three part series attended by 35 students worldwide, Fall 2009
•  "Hybrid Assembly and Defect Recognition," three weeks of in plant training  for over 70 students conducted at Miteq Inc in the Spring 2009

International Teaching and Training:

• Brisbane, Australia (March 2007 and 2011). Teaching and Consulting
• Sittard, Netherlands (November 2005). Taught 23 circuit designers, process engineers, and technicians a four day course titled Process Certification and Defect Recognition for Hybrids, Microcircuits, and RF/MMIC Modules
• Cork, Ireland (February 2001). Taught 32 engineers/technicians a course titled Process Certification and Defect Recognition for Hybrids, Microcircuits, and RF/MMIC Modules. The course was held in plant at ILC/Data Device Corporation, a leading worldwide supplier of state-of-the-art hybrid circuits for military avionics equipment
• Lead instructor (1995-1998) for Siemens automatic SMT pick-and-place equipment. Instructed numerous process engineers from all over the world (France, Germany, Mexico) at the NTC facility

Education:

• Masters of Engineering Administration, University of Utah, Salt Lake City, UT (1985)
• B.S. Metallurgy and Materials Engineering, Lehigh University, Bethlehem, PA (1982)
• USAF Air Command and Staff College (1999)

Technical Publications:

WHITE PAPER:  Hermetic vs. “Near Hermetic” Packaging - a Technical Review (free download)

• "Practical Guide to TM 1014 (SEAL)"  – Free Download
• "Moisture Sensing in Fusion Bonded Teflon Laminate Packages for RF Power Applications," IMAPS Military Space and Homeland Security Conference, (2007) Baltimore, MD
• "Optical Leak Detection vs. Conventional Helium Leak Detection in a Production Environment," JEDEX Conference (2003), San Jose, CA
• "Technology Insertion and Process Improvements - A Case Study," Proceedings of the International Society of Hybrid Microelectronics (1997), Philadelphia, PA
• "Using DOE to Reduce Costs and Improve the Quality of Microelectronic Manufacturing Processes," Proceedings of the International Society of Hybrid Microelectronics (1994), Boston, MA
• "Using DOE to Optimize Hermetic Package Seam Welding," Proceedings of the International Society of Hybrid Microelectronics (1992), San Francisco, CA
• "Helium Fine Leak Testing Using the Berquist Method," RADC/NIST Moisture Workshop (1992), Gaithersburg, MD
• "Corrosion of Chip Resistors within a Hybrid," RADC/NIST Moisture Workshop (1992), Gaithersburg, MD
• "Air Force Field Failure Return Program," Government Microcircuit Applications Conference (GOMAC) (1989), Orlando, FL
• "Air Force Field Failure Return Program," International Reliability Physics Symposium (IRPS) (1988), Monterey, CA
• "A Review of EOD/ESD Failures from AF Avionics Applications," EOS/ESD Symposium (1988). Also selected as one of the ten best ESD papers from the 1980s and published in book form

Professional Affiliations:
International Microelectronics and Packaging Society (IMAPS)

• Fellow of the Society
• Keystone Chapter President
• Co Chair 2010 IMAPS Advanced Technology Workshop on Microelectronics Packaging and Materials for Medical Devices
• National Professional Development Course Chair since 1993
• Ira Custman Award Winner
• Founder and General Chair of the IMAPS Optoelectronics Packaging Conference in Bethlehem, PA (2001/2002)
• Past Northeast IMAPS Regional Director, National Technical Committee Chair, Executive Council Member
• Chair of 2007 and 2008 Military and Homeland Security Conference (MASH)
• Founded and organized the IMAPS Regional Symposium at the National Training Center for Microelectronics (Northampton Community College), 1998-2002
• National Technical Committee Chair
• Initiated and produced "Hands-On" courses (Wirebond and Thick Film) at the Chicago, Boston, and Baltimore Symposia
• Individual/Corporate Member since 1988

Member IMAPS since 1992

Member IEEE since 2004