TJ Green Associates, LLC


Singapore Microwave Packaging Course

Singapore Microwave Packaging Technology

 

Singapore Microwave Packaging Course

 

Singapore - January 28-30, 2013 - Register Here

 

Microwave Packaging Technology
(3 DAYS)

 

Microwave Hybrids, MICs, RF MMIC modules all require a unique set of materials and processes necessary to achieve reliable operations in extreme military, aerospace and commercial environments. This three day course examines all aspects of microwave packaging from a practical perspective. The instructor shares valuable lessons learned from years of experience. Design issues, material trade offs, process selection are all covered in detail with the goal of imparting useful information to the students so they can return to the work place better equipped to assemble and manufacture reliable microwave hybrids for aerospace and other hi reliability commercial and medical device applications.

 

This course is intended as an introductory to intermediate level course for process engineers, designers, quality engineers, and managers responsible for design and manufacture of microwave hybrids.

 

Course Outline

 

Day 1:     

Introduction to Microwave Technology
Terminology and product definitions
Microwave hybrids, RF/MMIC modules
Military, aerospace, commercial and medical products

Requirements Flow Down and Design Guidelines
MIL-PRF-38534 Hybrid Performance Specification
MIL-STD-883 Test Methods

Manufacturing Assembly Process Overview
Basic hybrid microwave manufacturing process flows
Clean room requirements and industry protocols

Design for Manufacturability (DFM)
Rationale and significance of DFM
Typical problems encountered during hybrid manufacturing and
How they can be prevented!
Wafer Fabrication Processes
GaAs Gallium Arsenide wafer fabrication
GaN Gallium Nitride on SIC wafer fab technology
Device feature identification and significance   
Review of wafer fabrication defects at incoming inspection
e.g., airbridge and channel damage, excessive probe marks

Packaging Design Considerations
Thermal analysis, simulated stack up and junction temp calculations
Stress analysis and basic material consideration and trade offs

 

 

Day 2:

Substrate Technology
Teflon PTFE (duroid) and other soft board material sets
Alumina ceramic substrate fabrication

Thin Film Processes on Ceramic
Sputtering vs. vapor deposition
Photolithography, coat and etch
Performance issues
Plating processes and specifications

Laser Trimming of Precision Thin Film Resistors
Material and Process Fundamentals for Component Attach
Silver epoxy attach of substrate and MMIC die   
Handling and assembly of bare die
Solder and epoxy attach of discrete components

Eutectic Soldering Processes
AuSn solder attach of GaAs chips
Other eutectic solder process
Issues with die voiding and how to detect

Die, substrate and package compatibility
Coefficient of Thermal Expansion (CTE)
Material selection and design trade offs

Thermal Impedance and Importance of Minimizing Junction Temperature
Simple excel spreadsheet demonstrates importance of proper material selection for typical microwave hybrid material sets

Review of Defects from the Component Attach Processes

Overview of Common Cleaning Processes and Potential Problems
Wet chemicals, oxygen/argon plasma, UV Ozone

Wirebonding and Interconnect Process Overview
Ultrasonic/thermosonic bonding
Thermocompression bonding
Wedge and ribbon bonding
Gap Welding
Deep access bonding fine pitch bonding gate pads on FETs

End of day review of wirebond materials and processes

 

 

Day 3:

What is Hermeticity?
Hermetic Packaging Process Overview
Seam welding, solder seal
Laser welding aluminum and Al-Si alloys
Soldering in RF Feedthrus
Hermeticity Testing per MIL-STD-883 TM 1014 (SEAL)
Aerospace hermeticity requirements
Impact of tighter leak rate specifications
Theory and technical basis of hermeticity testing
Air leak vs. measured helium leak rate
Helium Fine Leak Testing
Fixed vs. flexible method
Gross Leak Testing
Bubble test, dye penetrant etc.   
Optical Leak Testing (OLT)
Cumulative Helium Leak Testing (CHLD)
Kr-85 Radioisotope based methods

Residual Gas Analysis (RGA) per Mil-Std-883 TM 1018 (IVA)
Theory and technical basis for RGA testing
Moisture problems in microelectronics
Outgassing in hermetic packages
Pre-bake process parameters and effect on RGA results
Particle, moisture, and hydrogen getters

“Near- Hermetic Packaging” and Testing Issues
Qualification of near hermetic packages for military applications
Ficks law of moisture diffusion
Moisture sensors
Student feedback and course critique

Course Registration

 

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