Consulting Services

From materials and process development to expert witness services and root cause FA investigations, TJ Green Associates provides the technical consulting services and expertise you demand.

• Materials and process development of hybrids and microwave modules
• Hermeticity expert
  • “Practical Guide to TM 1014 (SEAL)” – Free Download
• Die attach and wire bonding process development
• Microelectronic package design and material selection
• Failure analysis and root-cause identification
• Pre Cap source inspection per MIL-STD-883 Class K and Class H
• Technical writing and paper presentation
• MEMS packaging and hermeticity assessment
• Fully cleared DOD subcontractor
• Medical device consultant
• Expert Witness

TJ Green Associates has completed numerous successful consulting projects for military, space, and medical device clients.

• Drafted and delivered a complete Hybrid Microelectronics Workmanship and Quality Manual for the NASA Jet Propulsion Laboratory in Pasadena, CA
• Hermeticity evaluation, testing, and product development for a Class III medical implant
• Characterized the reliability and moisture ingress in near hermetic cavity-style Teflon® laminate packages for RF and telecom applications

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Moisture Testing
Tom has gained valuable experience with the use of humidity sensors placed inside a package cavity to evaluate the rate of moisture ingress into a sealed device. The actual leak rate of the package and rate of moisture intrusion can be monitored and recorded continuously under varying conditions of ambient temperature, humidity and pressure.

This hermeticity evaluation service is now available to help users characterize, develop and failure analyze hermetic and “near hermetic” package cavities. 

Publications

WHITE PAPER:  Hermetic vs. “Near Hermetic” Packaging - a Technical Review (free download)

TJ Green Associates has published the following papers. All publications are available upon request.

• “Technology Insertion and Process Improvements - A Case Study,” Proceedings of the International Society of Hybrid Microelectronics (1997) Philadelphia, PA
• “Using DOE to Reduce Costs and Improve the Quality of Microelectronic Manufacturing Processes,” Proceedings of the International Society of Hybrid Microelectronics (1994) Boston, MA
• “Using DOE to Optimize Hermetic Package Seam Welding,” Proceedings of the International Society of Hybrid Microelectronics (1992) San Francisco, CA
• “Helium Fine Leak Testing Using the Berquist Method,” presented at the RADC/NIST Moisture Workshop (1992) Gaithersburg, MD
• “Air Force Field Failure Return Program,” International Reliability Physics Symposium (IRPS) (1988) Monterey, CA
• “Air Force Field Failure Return Program,” Government Microcircuit Applications Conference (GOMAC) (1989) Orlando, FL
• “A Review of EOD/ESD Failures from AF Avionics Applications,”
  EOS/ESD Symposium (1988). Also selected as one of the ten best ESD
  papers from the 1980s and published in a book form.

References available upon request.

Consulting fees as arranged. Monthly retainer fee schedule available.

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Curriculum Vitae

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