Upcoming Advanced Technology Conference focused on “Near” or “Non” Hermetics…. take your pick!……..

Hermetic packaging has long provided the required protection from dust, dirt, contamination, moisture, and other threats to operating reliability for sensitive electronic devices. Hermetic packages are expensive and technical and manufacturing resources for them are diminishing in availability. Designers are searching for ways to lower cost, reduce weight and increase performance by looking to design-in alternate material sets including engineered plastics such as LCP and robust barriers offering enhanced protection from moisture permeation. There are a variety of materials and approaches that hold the promise of enhancing reliability of non-hermetics while reducing cost. The problem essentially becomes one of minimizing moisture diffusion through the bulk of package materials and at package/lead interfaces. Packages made from polymeric materials, or robust barrier coatings, as opposed to traditional hermetic seals (i.e. metal, ceramics, eutectic etc.) require a different approach from a reliability testing and qualification standpoint.

Packaging technologies and materials that are not hermetic, and that offer reliability without hermeticity, are available to the industry. These approaches include flip-chip laminate designs or cavity packages made of materials that provide physical protection for sealed devices, but which are not positively absolute barriers to moisture. The conference proposes to bring together providers of non-hermetic concepts, products, and materials, with package designers, manufacturing and assembly production engineers, quality and reliability managers, and program managers to explore and explain enhanced moisture resistance packaging and provide technical guidance to those capabilities for potential users of such packages especially, for high reliability environments with extended service life expectations
Learn more and attend the IMAPS Non-Hermetic Packaging Technology for Reliable Microelectronics  ATW scheduled for Jan 18th in Florida