TJ Green Associates, LLC is a veteran-owned small business specializing in packaging of microelectronic components for high-reliability military, aerospace, oil and gas, Class III medical, RF and microave applications and associated markets.
Thomas J. Green, Principal, has over 32 years combined experience in industry/academia and the Department of Defense.
Our specialty is instruction and training in microelectronic assembly and packaging with a strong focus on materials and processes. We also provide consulting services with expertise in materials and processes used to assemble hybrids, multichip modules, microwave hybrids, RF/MMIC modules, MEMS, medical implants, optoelectronics, sensors and other types of packaged microcircuits. Specific areas of expertise include hermeticity and "near hermetic" packaging, substrate fabrication, die attach, wirebond, visual inspection, materials and process development, process improvement via SPC/DOE analytical methods, failure analysis/root cause identification, and corrective actions.
As a company entering into its fifteenth year, TJ Green Associates is the recognized industry leader in teaching and consulting services for high-reliability military, space, and medical device applications.
Thomas J Green, Principal
Serving as a Research Scientist at the USAF RADC (Rome Air Development Center), Tom worked as a reliability engineer analyzing component failures from fielded Air Force avionic equipment.
As a Senior Process Engineer with Lockheed Martin Astronautics in Denver, CO, he was responsible for the materials and process used to assemble hybrid microelectronic components for military and aerospace applications, gaining valuable "hands-on" experience in wirebond, die attach, thick- and thin-film substrate fabrication, hermetic sealing, and leak test processes.
At the local college in Bethlehem, PA, Tom spent six years developing curriculum and teaching industry professionals about microelectronics assembly-related packaging and processes.