TJ Green Associates, LLC


About Us

 

TJ Green Associates, LLC is a veteran-owned small business specializing in packaging of microelectronic components for high-reliability military, aerospace, oil and gas, Class III medical, RF and microave applications and associated markets.

 

Thomas J. Green, Principal, has over 32 years combined experience in industry/academia and the Department of Defense.

 

Our specialty is instruction and training in microelectronic assembly and packaging with a strong focus on materials and processes. We also provide consulting services with expertise in materials and processes used to assemble hybrids, multichip modules, microwave hybrids, RF/MMIC modules, MEMS, medical implants, optoelectronics, sensors and other types of packaged microcircuits. Specific areas of expertise include hermeticity and "near hermetic" packaging, substrate fabrication, die attach, wirebond, visual inspection, materials and process development, process improvement via SPC/DOE analytical methods, failure analysis/root cause identification, and corrective actions.

Thomas Green

 

As a company entering into its fifteenth year, TJ Green Associates is the recognized industry leader in teaching and consulting services for high-reliability military, space, and medical device applications.

 

Thomas J Green, Principal

 

Serving as a Research Scientist at the USAF RADC (Rome Air Development Center), Tom worked as a reliability engineer analyzing component failures from fielded Air Force avionic equipment.

 

As a Senior Process Engineer with Lockheed Martin Astronautics in Denver, CO, he was responsible for the materials and process used to assemble hybrid microelectronic components for military and aerospace applications, gaining valuable "hands-on" experience in wirebond, die attach, thick- and thin-film substrate fabrication, hermetic sealing, and leak test processes.

 

At the local college in Bethlehem, PA, Tom spent six years developing curriculum and teaching industry professionals about microelectronics assembly-related packaging and processes. 

 

Curriculum Vitae

 

Client Listing

 

  • Specific areas of expertise include:

    • Hermeticity Testing and Military specifications TM 1014
    • Materials and processes for hybrid and microwave module assembly
    • Microelectronics packaging
    • Microwave packaging technology
    • Hermeticity and “near hermetic“ packaging
    • Visual inspection per MIL-STD-883
    • Wire bonding process development and failure analysis
    • Die bond processes including MMIC solder attach using AuSn
    • Failure analysis and root cause identification
    • Package design and material selection
    • Thick- and thin-film substrate fabrication
    • Advanced packaging
    • Hybrid process training
    • Expert witness cochlear implant failures
    • Class III medical implants
    • Military and aerospace microelectronic device applications
    • Reliability consultant
  •  Our teaching and consulting services include:
    • Public Courses Range from one to four days, and cover a variety of topics, including wirebonding, visual inspection and defect recognition, hermeticity testing, process certification, microwave packaging technology, design for manufacturability and much more.
    • In-Plant Training Any of our technology courses can be tailored and customized to meet your training requirements and budgetary constraints. In-plant offerings include “hands-on” courses at the machines for operators and technicians.
    • Webinars Don’t have the time…then learn it on-line! A variety of live and archived webinars are available for your learning convenience.
    • Consulting Services cover everything from materials and process development, hermeticity evaluation, root cause FA investigations, technical writing and presentations to serving as an expert witness.